MacDermid Alpha ELECTRONICS SOLUTIONS A Logo (WIPO, 23.08.2022)
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Die Internationale Marke MacDermid Alpha ELECTRONICS SOLUTIONS A wurde als Bildmarke am 23.08.2022 bei der Weltorganisation für geistiges Eigentum angemeldet.
Logodesign (Wiener Klassifikation)
#Ornamentale Motive #Briefe, die eine besondere Form des Schreibens darstellen #Etiketten in Form von Bändern oder Ringen
| Markenform | Bildmarke |
| Aktenzeichen | 1691767 |
| Länder | 
|
| Basismarke |
Nr. 97528454,
01. August 2022
|
| Anmeldedatum | 23. August 2022 |
| Ablaufdatum | 23. August 2032 |
Markeninhaber
245 Freight Street
Waterbury CT 06702
US
Waterbury CT 06702
US
Markenvertreter
195 Church Street,
P.O. Box 1950
US
Waren und Dienstleistungen
01
Chemicals for use in electroless plating and electroplating
processes; chemical compositions for metal plating;
pre-treatment preparations for plating; trivalent chromate
finishing and coating preparations for plating; metal
chlorides; chemicals for use in semiconductor manufacture,
semiconductor device fabrication and semiconductor
packaging; electroplating chemicals; chemicals for wafer
level semiconductor packaging processes; chemicals for panel
level semiconductor packaging processes; chemicals for fan
out wafer level semiconductor packaging processes; chemicals
for fan out panel level semiconductor packaging processes;
chemicals for use in the circuit board industry, namely,
peroxide and sulfuric acid based etchants and oxidants for
roughening or etching copper surfaces prior to multilayer
lamination of printed wiring boards; chemicals used in
industry; adhesives for use in electronics industry;
non-conductive adhesives for use in electronics industry;
unprocessed epoxy resins for use in electronics industry;
industrial adhesives used in the assembly, maintenance and
repair of electronics for use in electronics industry;
fillers for use with electronic components, namely,
unprocessed epoxy resins for use as underfill; unprocessed
epoxy resins; chemicals, namely, soldering flux; industrial
chemicals used for cleaning circuit boards and surface mount
devices; industrial adhesives, unprocessed artificial
resins, unprocessed synthetic resins, unprocessed epoxy
resins for bonding, wetproofing, coating, encapsulation,
sealing, molding, waterproofing, moisture proofing,
heatproofing, solder joint attachment applications in the
electronics industry
03
Cleaning agents
06
Metal wire; silver solder; gold solder; brazing alloy; hard
solder; metal rod for brazing and welding (including steel
titanium alloy); soft solder; solder preforms; brazed metal
electrode; welding metal rod; tin wire
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 03. August 2023 | 2023/31 Gaz | JP | Ablehnung |
| 19. Juli 2023 | 2023/29 Gaz | TR | Ablehnung |
| 03. Juni 2023 | 2023/24 Gaz | SG | Ablehnung |
| 05. April 2023 | 2023/14 Gaz | RU | RAW: Rule 18ter(2)(i) GP following a provisional refusal |
| 20. März 2023 | 2023/12 Gaz | EM | Ablehnung |
| 10. Februar 2023 | 2023/7 Gaz | RU | Ablehnung |
| 25. Januar 2023 | 2023/4 Gaz | GB | Ablehnung |
| 12. November 2022 | 2022/46 Gaz | PH | Ablehnung |
| 23. August 2022 | 2022/41 Gaz | US | Eintragung |
ID: 141691767