MacDermid Alpha ELECTRONICS SOLUTIONS A Logo (WIPO, 08/23/2022)
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The International trademark MacDermid Alpha ELECTRONICS SOLUTIONS A was filed as Figurative mark on 08/23/2022 at the World Intellectual Property Organization.
Logodesign (Wiener Klassifikation)
#Ornamental motifs #Letters presenting a special form of writing #Labels in the form of bands or rings
| Trademark form | Figurative mark |
| File reference | 1691767 |
| Countries | 
|
| Base trademark |
No. 97528454,
August 1, 2022
|
| Application date | August 23, 2022 |
| Expiration date | August 23, 2032 |
Trademark owner
245 Freight Street
Waterbury CT 06702
US
Waterbury CT 06702
US
Trademark representatives
195 Church Street,
P.O. Box 1950
US
goods and services
01
Chemicals for use in electroless plating and electroplating
processes; chemical compositions for metal plating;
pre-treatment preparations for plating; trivalent chromate
finishing and coating preparations for plating; metal
chlorides; chemicals for use in semiconductor manufacture,
semiconductor device fabrication and semiconductor
packaging; electroplating chemicals; chemicals for wafer
level semiconductor packaging processes; chemicals for panel
level semiconductor packaging processes; chemicals for fan
out wafer level semiconductor packaging processes; chemicals
for fan out panel level semiconductor packaging processes;
chemicals for use in the circuit board industry, namely,
peroxide and sulfuric acid based etchants and oxidants for
roughening or etching copper surfaces prior to multilayer
lamination of printed wiring boards; chemicals used in
industry; adhesives for use in electronics industry;
non-conductive adhesives for use in electronics industry;
unprocessed epoxy resins for use in electronics industry;
industrial adhesives used in the assembly, maintenance and
repair of electronics for use in electronics industry;
fillers for use with electronic components, namely,
unprocessed epoxy resins for use as underfill; unprocessed
epoxy resins; chemicals, namely, soldering flux; industrial
chemicals used for cleaning circuit boards and surface mount
devices; industrial adhesives, unprocessed artificial
resins, unprocessed synthetic resins, unprocessed epoxy
resins for bonding, wetproofing, coating, encapsulation,
sealing, molding, waterproofing, moisture proofing,
heatproofing, solder joint attachment applications in the
electronics industry
03
Cleaning agents
06
Metal wire; silver solder; gold solder; brazing alloy; hard
solder; metal rod for brazing and welding (including steel
titanium alloy); soft solder; solder preforms; brazed metal
electrode; welding metal rod; tin wire
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| August 3, 2023 | 2023/31 Gaz | JP | Rejection |
| July 19, 2023 | 2023/29 Gaz | TR | Rejection |
| June 3, 2023 | 2023/24 Gaz | SG | Rejection |
| April 5, 2023 | 2023/14 Gaz | RU | RAW: Rule 18ter(2)(i) GP following a provisional refusal |
| March 20, 2023 | 2023/12 Gaz | EM | Rejection |
| February 10, 2023 | 2023/7 Gaz | RU | Rejection |
| January 25, 2023 | 2023/4 Gaz | GB | Rejection |
| November 12, 2022 | 2022/46 Gaz | PH | Rejection |
| August 23, 2022 | 2022/41 Gaz | US | Registration |
ID: 141691767