Logo (USPTO, 02.03.2004)
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Mit unserer Markenüberwachung werden Sie automatisch per E-Mail über Nachahmer und Trittbrettfahrer benachrichtigt.
Die US-Marke wurde als Bildmarke am 02.03.2004 beim Amerikanischen Patent- und Markenamt angemeldet.
Sie wurde am 29.08.2006 im Markenregister eingetragen.
Der aktuelle Status der Marke ist "CANCELLED - SECTION 8".
| Markenform | Bildmarke |
| Aktenzeichen | 78377315 |
| Registernummer | 3136563 |
| Anmeldedatum | 02. März 2004 |
| Veröffentlichungsdatum | 20. Dezember 2005 |
| Eintragungsdatum | 29. August 2006 |
Markeninhaber
Pudong New Area
201203 Shanghai
CN
201203 Shanghai
CN
Markenvertreter
Waren und Dienstleistungen
40
Custom manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices; manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the order and/or specification of others; wafer, semiconductor and integrated circuit manufacturing, assembling and packaging services for others; semiconductor and integrated circuit cutting, molding and etching for others; integrated circuit wafer foundry services for others; integrated circuit photo mask and electronic chip or computer chip manufacturing to the order and/or specification of others; wafer, chip and semiconductor manufacturing to the order and/or specification of others, integrated circuit assembling services for others; silicon wafer photolithography, etching, thin film, diffusion, ion implanting and chemical mechanical polishing services for others; manufacture of printed circuits to the order and/or specification of others; photo mask manufacturing services for others; wafer probing services for others; manufacture of microdisplay devices, including liquid crystal on silicon devices, to the order and/or specification of others; manufacture of smart cards and sim cards for others
42
Design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; custom design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the specification of others; simulation, namely, testing, verification and analysis of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; design of printed circuits for others; photo mask design services for others; design of microdisplay devices, including liquid crystal on silicon devices, for others; design of smart cards and sim cards for others
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ID: 1378377315