Logo (USPTO, 03/02/2004)
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The US trademark was filed as Figurative mark on 03/02/2004 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 08/29/2006.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Figurative mark |
| File reference | 78377315 |
| Register number | 3136563 |
| Application date | March 2, 2004 |
| Publication date | December 20, 2005 |
| Entry date | August 29, 2006 |
Trademark owner
Pudong New Area
201203 Shanghai
CN
201203 Shanghai
CN
Trademark representatives
goods and services
40
Custom manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices; manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the order and/or specification of others; wafer, semiconductor and integrated circuit manufacturing, assembling and packaging services for others; semiconductor and integrated circuit cutting, molding and etching for others; integrated circuit wafer foundry services for others; integrated circuit photo mask and electronic chip or computer chip manufacturing to the order and/or specification of others; wafer, chip and semiconductor manufacturing to the order and/or specification of others, integrated circuit assembling services for others; silicon wafer photolithography, etching, thin film, diffusion, ion implanting and chemical mechanical polishing services for others; manufacture of printed circuits to the order and/or specification of others; photo mask manufacturing services for others; wafer probing services for others; manufacture of microdisplay devices, including liquid crystal on silicon devices, to the order and/or specification of others; manufacture of smart cards and sim cards for others
42
Design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; custom design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the specification of others; simulation, namely, testing, verification and analysis of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; design of printed circuits for others; photo mask design services for others; design of microdisplay devices, including liquid crystal on silicon devices, for others; design of smart cards and sim cards for others
ID: 1378377315