POSEIDON STT Logo (USPTO, 12/18/1997)
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The US trademark POSEIDON STT was filed as Figurative mark on 12/18/1997 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 03/02/1999.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Figurative mark |
| File reference | 75408197 |
| Register number | 2228092 |
| Application date | December 18, 1997 |
| Publication date | December 8, 1998 |
| Entry date | March 2, 1999 |
Trademark owner
Carl-Benz-Strasse 10
72124 Pliezhausen
DE
72124 Pliezhausen
DE
Trademark representatives
goods and services
7
machines for manufacturing semiconductor substrates, silicon chips, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips and/or solar cells; machines for drying, cleaning and/or etching silicon wafers for use in the manufacture of semiconductor chips; wet processing machines for use in the manufacture of semiconductor chips and wet processing machines for oxidation by diluted hydrofluoric and hydrochloric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and drying units using nitrogen, alcohol vapors and/or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells, as machine parts
11
drying and wet processing units for the treatment of semiconductor substrates, silicon chips, wafers, liquid crystal substrates, liquid crystal displays, semiconductor wafers and solar cells as well as their surfaces
37
Installation and servicing of the following machines and units - machines for manufacturing semiconductor substrates, silicon chips, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips and/or solar cells; machines for drying, cleaning and/or etching silicon wafers for use in the manufacture of semiconductor chips; wet processing machines for use in the manufacture of semiconductor chips and wet processing machines for oxidation by diluted hydrofluoric and hydrochloric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and drying units using nitrogen, alcohol vapors and/or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells, as machine parts; drying and wet processing units for the treatment of semiconductor substrates, silicon chips, wafers, liquid crystal substrates, liquid crystal displays, semiconductor wafers and solar cells as well as their surfaces
ID: 1375408197