CNSOLDER

WIPO WIPO 2021

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The International trademark CNSOLDER was filed as Word mark on 12/06/2021 at the World Intellectual Property Organization.

Trademark Details Last update: July 18, 2023

Trademark form Word mark
File reference 1641956
Countries China European Community South Korea Malaysia Philippines Thailand United States of America (USA)
Base trademark JP No. 2021-144641, November 19, 2021
Application date December 6, 2021
Expiration date December 6, 2031

Trademark owner

23 Senju-hashido-cho,
Adachi-ku
JP

Trademark representatives

c/o OHNO & PARTNERS, Marunouchi Kitaguchi Bldg. 21F, JP

goods and services

01 Soldering chemicals; soldering fluxes; soldering paste; chemicals
06 Nonferrous metals and their alloys; copper and its alloys; lead and its alloys; tin and its alloys; solder; solder alloys; silver solder; gold solder; lead-free solder; solder in the form of ball; solder in the form of rod; solder in the form of line; solder with grease; metal wires for soldering; solder in the form of paste; solder in the form of powder
40 Metal working; metal casting; soldering

Trademark history

Date Document number Area Entry
July 14, 2023 2023/29 Gaz TH Rejection
June 28, 2023 2023/26 Gaz MY Rejection
March 24, 2023 2023/13 Gaz KR Rejection
November 26, 2022 2022/48 Gaz US Rejection
June 22, 2022 2022/25 Gaz EM Rejection
June 13, 2022 2022/24 Gaz CN Rejection
April 5, 2022 2022/16 Gaz PH Rejection
December 6, 2021 2022/3 Gaz JP Registration

ID: 141641956