NLAYER

WIPO WIPO 2019

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Die Internationale Marke NLAYER wurde als Wortmarke am 08.04.2019 bei der Weltorganisation für geistiges Eigentum angemeldet.

Markendetails Letztes Update: 28. Juli 2022

Markenform Wortmarke
Aktenzeichen 1476848
Länder China Europäische Gemeinschaft Südkorea Vereinigte Staaten von Amerika (USA)
Basismarke JP Nr. 2019-035032, 08. März 2019
Anmeldedatum 08. April 2019
Ablaufdatum 08. April 2029

Markeninhaber

388, Oaza Okura, Ranzan-machi,
Hiki-gun
JP

Markenvertreter

C/O SAKURAGI Patent & Trademark Daimon Building 4F, JP

Waren und Dienstleistungen

01 Chemicals for use in the process of producing printed circuit boards, namely, resist ink; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; photoresists; photosensitive resists in the form of film for use in the process of producing printed circuit boards; chemical coatings for use in the process of producing printed circuit boards; chemical coatings; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards
02 Paints for blocking light; paints for reflecting light; marking inks for use in the process of producing printed circuit boards; hole plugging inks for use in the process of producing printed circuit boards; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing ink
17 Electrical insulating resists in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics
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Markenhistorie

Datum Belegnummer Bereich Eintrag
29. September 2020 2020/40 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
02. September 2020 2020/36 Gaz KR RAW: Rule 18ter(2)(ii) GP following a provisional refusal
09. April 2020 2020/16 Gaz KR Ablehnung
13. Dezember 2019 2019/51 Gaz EM Ablehnung
06. September 2019 2019/37 Gaz US Ablehnung
30. August 2019 2019/36 Gaz CN Ablehnung
08. April 2019 2019/26 Gaz JP Eintragung

ID: 141476848