NLAYER Logo (WIPO, 04/08/2019)
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The International trademark NLAYER was filed as Word mark on 04/08/2019 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1476848 |
| Countries | 
|
| Base trademark |
No. 2019-035032,
March 8, 2019
|
| Application date | April 8, 2019 |
| Expiration date | April 8, 2029 |
Trademark owner
388, Oaza Okura, Ranzan-machi,
Hiki-gun
JP
Hiki-gun
JP
Trademark representatives
C/O SAKURAGI Patent & Trademark
Daimon Building 4F,
JP
goods and services
01
Chemicals for use in the process of producing printed
circuit boards, namely, resist ink; chemicals for use in the
process of producing printed circuit boards, namely, solder
resists; chemical preparations for use in the process of
producing printed circuit boards, namely, solder mask;
dilution agents for solder resists; photoresists;
photosensitive resists in the form of film for use in the
process of producing printed circuit boards; chemical
coatings for use in the process of producing printed circuit
boards; chemical coatings; chemicals for use in the process
of producing printed circuit boards, namely, chemical agents
for plugging holes on printed circuit boards
02
Paints for blocking light; paints for reflecting light;
marking inks for use in the process of producing printed
circuit boards; hole plugging inks for use in the process of
producing printed circuit boards; heat-resistant paints;
paints; printing inks for use in the process of producing
printed circuit boards; printing ink
17
Electrical insulating resists in the liquid form for use in
the process of producing printed circuit boards; insulating
resin materials for use in the process of producing printed
circuit boards; insulating resin materials for interlayer
dielectric materials in the liquid form for use in the
process of producing build-up boards; insulating resin
materials for interlayer dielectric materials for use in the
process of producing build-up boards; insulating resin
materials for interlayer dielectric materials in the form of
film for use in the process of producing build-up boards;
insulating coating materials for use in the process of
producing printed circuit boards; insulating coating
materials for use in the process of producing display
panels; insulating coating materials for protecting copper
foil on the surface of printed circuit boards; insulating
coating materials for use in the process of producing
package application boards; insulating coating materials for
use in the process of producing flexible printed circuit
boards; insulating fillers for protecting copper foil used
with holes of printed circuit boards; electrical insulating
materials for use in the process of producing printed
circuit boards; semi-processed plastics
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| September 29, 2020 | 2020/40 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| September 2, 2020 | 2020/36 Gaz | KR | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| April 9, 2020 | 2020/16 Gaz | KR | Rejection |
| December 13, 2019 | 2019/51 Gaz | EM | Rejection |
| September 6, 2019 | 2019/37 Gaz | US | Rejection |
| August 30, 2019 | 2019/36 Gaz | CN | Rejection |
| April 8, 2019 | 2019/26 Gaz | JP | Registration |
ID: 141476848