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Die US-Marke BULC wurde als Wortmarke am 22.09.2004 beim Amerikanischen Patent- und Markenamt angemeldet.
Sie wurde am 19.12.2006 im Markenregister eingetragen.
Der aktuelle Status der Marke ist "CANCELLED - SECTION 8".
| Markenform | Wortmarke |
| Aktenzeichen | 78488026 |
| Registernummer | 3185525 |
| Anmeldedatum | 22. September 2004 |
| Veröffentlichungsdatum | 03. Oktober 2006 |
| Eintragungsdatum | 19. Dezember 2006 |
Markeninhaber
14-18, Takatsuji-cho, Mizuho-ku
Nagoya City
JP
Nagoya City
JP
Markenvertreter
Waren und Dienstleistungen
9
Substrates for semi-conductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, namely, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards
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ID: 1378488026