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The US trademark BULC was filed as Word mark on 09/22/2004 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 12/19/2006.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Word mark |
| File reference | 78488026 |
| Register number | 3185525 |
| Application date | September 22, 2004 |
| Publication date | October 3, 2006 |
| Entry date | December 19, 2006 |
Trademark owner
14-18, Takatsuji-cho, Mizuho-ku
Nagoya City
JP
Nagoya City
JP
Trademark representatives
goods and services
9
Substrates for semi-conductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, namely, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards
ID: 1378488026