TOYO K

WIPO WIPO 2008

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Die Internationale Marke TOYO K wurde als Bildmarke am 17.10.2008 bei der Weltorganisation für geistiges Eigentum angemeldet.

Logodesign (Wiener Klassifikation)

#Kreise #Ein Kreis #Kreise, die einen oder mehrere Buchstaben enthalten

Markendetails Letztes Update: 07. Mai 2019

Markenform Bildmarke
Aktenzeichen 989681
Länder Vereinigte Staaten von Amerika (USA)
Basismarke JP Nr. 2008-030243, 17. April 2008
Anmeldedatum 17. Oktober 2008
Ablaufdatum 17. Oktober 2018

Markeninhaber

7-12 Takeshima 5-chome,
Nishiyodogawa-ku,
JP

Markenvertreter

Umeda Hankyu Blds, Office Tower, 8-1, JP

Waren und Dienstleistungen

01 Carbon; carbides; carbon for producing fullerene and carbon nanotube; carbon compounds for producing fullerene and carbon nanotube; chemicals composed of fullerene and carbon nanotube structure; chemicals
07 Metalworking machines, tools and their parts and fittings; chemical processing machines, apparatus and their parts and fittings; glassware manufacturing machines, apparatus and their parts and fittings; nozzles made of carbon fiber for arc-welding machine; parts and fittings for semiconductor manufacturing machines and systems used for producing epitaxial structures for semiconductor wafers; susceptors for holding wafers as parts of semiconductor manufacturing machines and systems; parts and fittings for compound semiconductor manufacturing machines and systems; parts and fittings for semiconductor manufacturing machines and systems used for producing epitaxial structures for compound semiconductor wafers; susceptors for holding wafers as parts of machines and systems for manufacturing compound semiconductors; semiconductor manufacturing machines, systems and their parts and fittings; parts for non-electric prime movers for land vehicles; bearings (machine elements not for land vehicles); electric brushes; parts and fittings for electric wires and cables manufacturing machines and systems; susceptors for holding silicon wafers as parts of semiconductor manufacturing machines and systems; susceptors for holding wafers as parts of plasma-enhanced chemical vapour deposition (CVD) machines used for manufacturing semiconductors; susceptors for holding wafers as parts of metal-organic CVD machines for manufacturing semiconductors; parts and fittings for compressors for machines and systems for generating fluorine gas and for generating gas including chemical elements of fluorine gas; parts and fittings for non-electric prime movers (not for land vehicles); machines elements (not for land vehicles); parts and fittings of motor or engines for satellite launching vehicles, namely nozzle throats
09 Electrolysers (electrolytic cells) and their parts and fittings; crucibles, namely containers for melting silicon or germanium for semiconductors; crucibles, namely containers for melting material for compound semiconductors; crucibles, namely containers for melting material at high temperatures; crucibles, namely containers for melting metals at high temperatures; laboratory apparatus, instruments and their parts and fittings; measuring or testing machines, instruments and their parts and fittings; parts and fittings for electronic machines and apparatus; carbon electrodes for manufacturing fullerene; electrolytic cells (electrolyzers) for machines and systems for generating fluorine gas and for generating gas including chemical elements of fluorine gas; electrodes for plasma etching equipment; electrodes for electric discharge machining; electrodes for electrolytic polishing apparatus; electrodes for machines and systems for generating fluorine gas and for generating gas including chemical elements of fluorine gas; electrodes and their fittings
11 Heat exchangers (for chemical processing) and their parts and fittings; heaters for semiconductor manufacturing machines and systems; heaters for compound semiconductor manufacturing machines and systems; jigs for holding wafers as parts of diffusion furnaces; heaters for crucibles; industrial furnaces and their parts and fittings; parts and fittings for furnaces used for growing single crystals using the pulling method for the manufacture of semiconductors; parts and fittings for furnaces used for producing epitaxial structures for semiconductor wafers; parts and fittings for thermal diffusion furnaces for inducting dopant for semiconductor; parts and fittings for furnaces of forming semiconductor thin films; parts and fittings for electric furnaces used for growing crystals for the manufacture of semiconductors; parts for carbon fiber reinforced carbon composite material for industrial furnaces; parts and fittings of furnaces for annealing treatment machines; parts and fittings of furnaces for crystal growth system; crucibles, namely containers for melting material as parts of industrial furnaces; susceptors for holding materials as parts of industrial furnaces; heaters for industrial furnaces; industrial furnaces; parts for carbon fiber reinforced carbon composite material for nuclear reactors (atomic piles); nuclear reactors (atomic piles) and their parts and fittings; fluorine gas generating machines, systems and their parts and fittings; machines and systems for generating fluorine gas and for generating gas including chemical elements of fluorine gas; heating devices for machines and systems for generating fluorine gas and for generating gas including chemical elements of fluorine gas; industrial boilers and their parts and fittings; non-electric heaters and their parts and fittings; parts and fittings for electric furnaces for growing crystals for the manufacture of compound semiconductors; stainless steel reservoir tanks for gas generators used for generating fluorine gas and other gases, including chemical elements of fluorine gas
12 Parts and fittings for aircraft; railway rolling stock and their parts and fittings; automobiles and their parts and fittings; machine elements for land vehicles, namely bearings (for land vehicles) and vane for brake pump
17 Seals; gaskets; joints for pipes (not of metal); packings
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen

Markenhistorie

Datum Belegnummer Bereich Eintrag
27. April 2019 2019/17 Gaz Löschung
28. März 2018 2018/14 Gaz US RAW: Total Invalidation
04. April 2011 2013/5 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
19. Mai 2010 2013/3 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
11. August 2009 2009/44 Gaz JP RAW: Partial Ceasing Effect
13. Februar 2009 2009/8 Gaz US Ablehnung
17. Oktober 2008 JP Eintragung

ID: 14989681