CMPLICITY

WIPO WIPO 2007

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Die Internationale Marke CMPLICITY wurde als Wortmarke am 07.10.2007 bei der Weltorganisation für geistiges Eigentum angemeldet.

Markendetails Letztes Update: 02. September 2022

Markenform Wortmarke
Aktenzeichen 966067
Länder China Europäische Gemeinschaft Südkorea Singapur
Basismarke US Nr. 77175261, 08. Mai 2007
Anmeldedatum 07. Oktober 2007
Ablaufdatum 28. Dezember 2009

Markeninhaber

7 Commerce Drive
Danbury, CT 06810
US

Markenvertreter

P.O. Box 14329 Research Triangle Park, NC 27709 US

Waren und Dienstleistungen

01 Chemicals for use in chemical mechanical polishing processes in the manufacture of semiconductor and microelectronic products; chemical mechanical polishing compositions for use in chemical mechanical polishing processes in the manufacture of semiconductor and microelectronic products; colloidal suspensions, wetting agents, and oxidizers for use in chemical mechanical polishing processes in the manufacture of semiconductor and microelectronic products
07 Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, all for use in delivering chemicals and chemical mechanical polishing and planarization compositions to chemical mechanical polishing and planarization processes conducted by such semiconductor manufacturing machines and semiconductor wafer processing equipment in the manufacture of semiconductor and microelectronic products, namely, storage and dispensing vessels and apparatus for holding and dispensing chemical mechanical polishing and planarization compositions, blenders and dispensers for use in mixing and delivering chemicals and chemical mechanical polishing and planarization compositions to chemical mechanical polishing and planarization, storage and dispensing vessels for holding post-chemical mechanical polishing and planarization cleaning compositions, and blenders and dispensers for use in delivering chemicals and post-chemical mechanical polishing and planarization cleaning compositions to post-chemical mechanical polishing and planarization cleaning processes (terms considered too vague by the International Bureau - Rule 13.2.b) of the Common Regulations)
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Markenhistorie

Datum Belegnummer Bereich Eintrag
14. Juli 2010 2010/39 Gaz US RAW: Total Ceasing Effect
27. November 2009 2010/9 Gaz JP RAW: Second Part Fee Not Paid
19. November 2009 2010/7 Gaz SG RAW: Rule 18ter(2)(ii) GP following a provisional refusal
05. Oktober 2009 2009/50 Gaz KR Ablehnung
27. August 2009 2012/52 Gaz JP Entscheidung zu Widerspruch
27. Mai 2009 2009/22 Gaz EM RAW: Protection Granted
02. März 2009 2009/11 Gaz KR Ablehnung
05. Februar 2009 2009/7 Gaz JP Ablehnung
28. Juli 2008 2008/32 Gaz SG Ablehnung
07. Oktober 2007 2008/26 Gaz US Eintragung

ID: 14966067