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Die Internationale Marke UNOVIS SOLUTIONS wurde als Wortmarke am 14.03.2007 bei der Weltorganisation für geistiges Eigentum angemeldet.
| Markenform | Wortmarke |
| Aktenzeichen | 946249 |
| Länder | 
|
| Basismarke |
Nr. 77003063,
20. September 2006
|
| Anmeldedatum | 14. März 2007 |
| Ablaufdatum | 14. März 2017 |
Markeninhaber
P.O. Box 825
Binghamton, NY 13902-0825
US
Binghamton, NY 13902-0825
US
Markenvertreter
22 Century Hill Drive, Suite 302
Latham, NY 12110
US
Waren und Dienstleistungen
07
Electronics assembly machines that complement and enhance
standard surface mount equipment for the automotive,
component assembly, telecommunications, and medical markets,
namely semiconductor manufacturing machines, component
assembly machines, and printed circuit board assembly
machines; semiconductor wafer processing machines and
semiconductor substrates manufacturing machines;
semiconductor manufacturing machines featuring component and
die feeders, conveyors, process peripherals and flexible
process cells; semiconductor manufacturing machines for use
in flip chip and die bonding, hybrid module assembly, and
mechanical assembly utilizing surface mount and insertion
mount equipment.
09
Electrical controllers and computer software for use in
controlling electronics and semiconductor component assembly
machines, all for use by customers in the automotive,
component assembly, telecommunications, and medical markets;
computer software for determining optimum processes for
assembling electronics and semiconductor components, for use
by customers in the automotive, component assembly,
telecommunications, and medical markets; computer based
apparatus for designing the layout of electronic circuits;
electrical controllers and computer software for use in
controlling semiconductor manufacturing machines that
perform flip chip and die bonding, hybrid module assembly,
and mechanical assembly, utilizing surface mount and
insertion mount equipment.
40
Consulting for others in the field of electronics assembly
and processes for assembling semiconductor components;
providing information to others in the field of electronics
and semiconductor component assembly related to flip chip
and die bonding, hybrid module assembly, and mechanical
assembly.
42
Research and development in the field of surface mount and
insertion mount electronics assembly equipment; engineering
services in the field of electronics assembly equipment for
customers in the automotive, semiconductor component
assembly, telecommunications, and medical markets; design,
development and testing of new products for others in the
field of electronics assembly equipment.
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 23. September 2017 | 2017/38 Gaz | Löschung | |
| 27. Januar 2010 | 2010/21 Gaz | SE | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 04. August 2009 | 2009/37 Gaz | US | RAW: Partial Ceasing Effect |
| 07. Juli 2009 | 2012/52 Gaz | KR | Entscheidung zu Widerspruch |
| 09. März 2009 | 2009/12 Gaz | SE | Ablehnung |
| 03. Oktober 2008 | 2008/41 Gaz | KR | Ablehnung |
| 14. März 2007 | US | Eintragung |
ID: 14946249