SOLDERBOND

WIPO WIPO 1998

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The International trademark SOLDERBOND was filed as Word mark on 12/08/1998 at the World Intellectual Property Organization.

Trademark Details Last update: December 19, 2022

Trademark form Word mark
File reference 706256
Register number 39816764
Countries em Switzerland Czechia France Serbia Russia Ukraine Vietnam
Base trademark DE No. 398 16 764, December 8, 1998
Application date December 8, 1998
Expiration date December 8, 2028

Trademark owner

Erasmusstraße 20
10553 Berlin
DE

goods and services

01 Chemical products for electroplating

Trademark history

Date Document number Area Entry
March 6, 2019 2019/10 Gaz EM Rejection
December 8, 2018 2018/50 Gaz Extension
September 11, 2018 2018/38 Gaz Correction
December 8, 2008 2008/50 Gaz Extension
March 24, 2003 2003/8 Gaz CN RAW: Final Confirmation Refusal
September 18, 2000 2000/19 Gaz ES RAW: Final Reversing Refusal
November 16, 1999 1999/23 Gaz ES Rejection
October 25, 1999 1999/22 Gaz CN Rejection
December 8, 1998 1999/3 Gaz DE Registration
Partial deletion
Partial deletion

ID: 14706256