Logo (WIPO, 29.08.2022)
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Die Internationale Marke wurde als Bildmarke am 29.08.2022 bei der Weltorganisation für geistiges Eigentum angemeldet.
Logodesign (Wiener Klassifikation)
#Flaggen #Verschiedene geometrische Figuren, nebeneinander, verbunden oder sich überschneidend #Eine Flagge #Stilisierte Flaggen #Andere Kombinationen von verschiedenen geometrischen Figuren, nebeneinander, verbunden oder sich überschneidend, Kombinationen von mehr als zwei verschiedenen geometrischen Figuren
| Markenform | Bildmarke |
| Aktenzeichen | 1708010 |
| Länder | 
|
| Basismarke |
Nr. 97534812,
04. August 2022
|
| Anmeldedatum | 29. August 2022 |
| Ablaufdatum | 29. August 2032 |
Markeninhaber
245 Freight Street
Waterbury CT 06702
US
Waterbury CT 06702
US
Markenvertreter
195 Church Street,
P.O. Box 1950
US
Waren und Dienstleistungen
01
Hydraulic fluids; pressure compensating fluids; motion
compensating fluids; hydraulic fluids for subsea production
control systems; well control fluids; subsea blowout
preventer control fluids; surface blowout preventer control
fluids; chemicals used in the oil and gas, exploration and
production industry; industrial chemicals for use in
plating, cleaning and etching metal and plastic surfaces;
chemicals for use in the manufacture of commercial and
industrial printing plates, namely, polymer compositions;
chemicals for use in electroless plating and electroplating
processes; chemical compositions for metal plating;
pre-treatment preparations for plating; trivalent chromate
finishing and coating preparations for plating; metal
chlorides; chemicals for use in semiconductor manufacture,
semiconductor device fabrication and semiconductor
packaging; electroplating chemicals; chemicals for wafer
level semiconductor packaging processes; chemicals for panel
level semiconductor packaging processes; chemicals for fan
out wafer level semiconductor packaging processes; chemicals
for fan out panel level semiconductor packaging processes;
chemicals for use in the circuit board industry, namely,
peroxide and sulfuric acid based etchants and oxidants for
roughening or etching copper surfaces prior to multilayer
lamination of printed wiring boards; chemicals used in
industry; adhesives for use in electronics industry;
non-conductive adhesives for use in electronics industry;
unprocessed epoxy resins for use in electronics industry;
industrial adhesives used in the assembly, maintenance and
repair of electronics for use in electronics industry;
fillers for use with electronic components, namely,
unprocessed epoxy resins for use as underfill; unprocessed
epoxy resins; chemicals, namely, soldering flux; industrial
chemicals used for cleaning circuit boards and surface mount
devices; industrial adhesives, unprocessed artificial
resins, unprocessed synthetic resins, unprocessed epoxy
resins for bonding, wetproofing, coating, encapsulation,
sealing, molding, waterproofing, moisture proofing,
heatproofing, solder joint attachment applications in the
electronics industry; chemicals used in the cleaning,
etching and plating of metals and non-metal substrates;
chemicals used in the production of printed circuit boards
and semiconductor materials; industrial chemicals; chemical
preparations for scientific use (other than for medical or
veterinary use); chemicals for laboratory analyses (other
than for medical or veterinary use); chemical reagents
(other than for medical or veterinary use); compositions for
chemically modifying metal and nonmetal products; chemical
used in activating, acidification, coating, drying,
retouching and altering metal and nonmetal products;
chemicals used for separating chromium compounds from
aqueous solutions
03
Cleaning agents
04
Lubricants
06
Metal wire; silver solder; gold solder; brazing alloy; hard
solder; metal rod for brazing and welding (including steel
titanium alloy); soft solder; solder preforms; welding metal
rod; tin wire
07
Machine for use in fabricating printing photopolymer plates,
namely for ultraviolet exposure and imaging equipment,
infrared imaging equipment, solvent and thermal developing
equipment, detackification equipment, and post exposure
processing equipment
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 09. August 2023 | 2023/32 Gaz | ID | Ablehnung |
| 08. Juni 2023 | 2023/23 Gaz | EM | Ablehnung |
| 24. April 2023 | 2023/17 Gaz | GB | Ablehnung |
| 02. Februar 2023 | 2023/6 Gaz | US | Korrektur |
| 29. August 2022 | 2023/1 Gaz | US | Eintragung |
ID: 141708010