07
Lithography machines for the manufacture of
microelectronics, integrated circuits, light emitting
diodes, and semiconductors on laminar substrates including
wafers, glass panels, and packaging panels such as copper
plate or plastic; optical metrology, characterization, and
inspection systems comprised of a machine, components and
operating software therefor sold as a unit for use in the
production of laminar substrates including discrete
electronic components, semiconductors including non-volatile
and volatile memory devices, foundry and logic devices, asic
devices, cmos image sensors, microelectromechanical systems,
light emitting diodes, and other micro and nano technology
devices, system in package, heterogeneous packaging, and
other advanced packaging electronics technologies; optical
metrology, characterization, and inspection systems
comprised of machine, components and operating software
therefor sold as a unit for use in the production of
precision machined optical surfaces, optical coatings, and
optical assemblies including reference flat, sphere, asphere
and assemblies composed of both refractive and reflective
components
09
Optical metrology, characterization, and inspection systems
comprised of machine, components and operating software
therefor sold as a unit for use in the testing of
transmitted wavefront and surface shape of optical
components, surface roughness of optics, metals,
semiconductors, ceramics, plastics, paints and other finely
finished materials, and defects and geometries of parts in
aerospace, automotive, power generation, semiconductor, data
storage, bearings, additive manufacturing and other
precision-machined components; interferometers for use in
the testing of transmitted wavefront and surface shape of
optical components, surface roughness of optics, metals,
semiconductors, ceramics, plastics, paints and other finely
finished materials, and defects and geometries of parts in
aerospace, automotive, power generation, semiconductor, data
storage, bearings, additive manufacturing and other
precision-machined components; downloadable software,
namely, process control and defect analysis software for use
in the production of laminar substrates including discrete
electronic components, semiconductors including non-volatile
and volatile memory devices, foundry and logic devices, asic
devices, cmos image sensors, microelectromechanical systems,
light emitting diodes, and other micro and nano technology
devices, system in package, heterogeneous packaging, and
other advanced packaging electronics technologies
42
Providing temporary use on online, nondownloadable process
control and defect analysis software for use in the
production of laminar substrates including discrete
electronic components, semiconductors including non-volatile
and volatile memory devices, foundry and logic devices, asic
devices, cmos image sensors, microelectromechanical systems,
light emitting diodes, and other micro and nano technology
devices, system in package, heterogenous packaging, and
other advanced packaging electronics technologies
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