09
Semiconductors; integrated electronic circuits; electronic
components containing micro-electro-mechanical systems
(MEMS) based sensors and actuators; electronic components,
namely, system-in-package (SIP) modules, and
multi-chip-modules (MCM) being integrated circuits;
downloadable software for use with semiconductors for
opening or closing an electric circuit; downloadable
software for use with integrated electronic circuits for
opening or closing an electric circuit; downloadable
software for use with electronic components containing
micro-electro-mechanical systems (MEMS) based sensors and
actuators for opening or closing an electric circuit;
downloadable software for use with electronic components,
namely, system-in-package (SIP) modules, and
multi-chip-modules (MCM) for opening or closing an electric
circuit; downloadable software for use with multiple
industries, namely, next generation 5G mobile networks,
industrial IoT markets, battery management, home automation,
electronic vehicles and medical instrumentation for opening
or closing an electric circuit
42
Scientific and technological services, namely, research,
design, and development services of integrated electronic
circuits, electronic components containing
micro-electro-mechanical systems (MEMS) based sensors and
actuators, system-in-package (SIP) modules, and
multi-chip-modules (MCM); Platform as a service (PAAS)
featuring computer software platforms for scientific and
technological services, namely, research, design, and
development services of integrated electronic circuits,
electronic components containing micro-electro-mechanical
systems (MEMS) based sensors and actuators,
system-in-package (SIP) modules, and multi-chip-modules
(MCM); Platform as a service (PAAS) featuring computer
software platforms for use with multiple industries, namely,
next generation 5G mobile networks, industrial IoT markets,
battery management, home automation, electronic vehicles and
medical instrumentation for opening or closing an electric
circuit