07
Machines, namely machine tools; machines and other
devices/equipment, other than hand operated, in each case
for the preparation of three-dimensional (3D) structures by
way of laser methods, inter alia for optical packages,
optical elements like micro-optics, e.g. lenses, diffractive
optical elements, MEMS/MOEMS, actors, biochips, microfluidic
cells, (tissue) scaffolds, implants like cochlea implants,
masks, inter alia for the preparation of structures for the
nano-imprint lithography, refinement structures, inter alia
for watches/clocks or pictures/images, safety structures,
inter alia for bank notes or credit cards, wherein the said
machines and other devices/equipment, other than hand
operated, for the preparation of three-dimensional (3D)
structures by way of laser methods are specifically, but not
necessarily equipped with software suitable for the said
structures and/or may comprise integrated modules for
exposure (imaging) and/or coating tasks; all aforementioned
machines and other devices/equipment preferably in the form
of modular devices; 3D printers, preferably in the form of
modular devices
09
Scientific, surveying, photographic, optical, measuring,
signalling, checking (supervision) apparatus and
instruments; apparatus and instruments for conducting,
switching, transforming, storing, regulating and controlling
of electricity or light; magnetic data carriers; digital
data carriers; instruments or sensors for the exact optical
detection of the position of pre-manufactured and/or
assembled elements, components, or modules; lasers for
industrial and scientific properties: lasers for measuring
purposes; chips [integrated circuits]; optical apparatus and
instruments; optical data carriers; optical fiber cables;
optical fibers [light conducting filaments]; optical
condensers; optical lamps; optical lenses; optical discs
[data processing]; optical mirrors, optical glass; physical
apparatus and instruments; prisms [optics]; refractors;
scanners; switches; switches [circuit breakers]; silicon
disks for integrated circuits; connectors [electricity],
also optical; optical, electric and electro-optical
contacts; optical conductors; printed circuit boards;
objectives [optics]; optical electronic parts; optical
filters; optical couplings; optical light beam deflectors;
optical scanners; optical switches; optical transmitters;
optical data lines; optical transmitters for use with light
conducting cables; optical sensors; optical splice connector
elements; optical connectors; connecting sleeves for optical
fibers; all above mentioned goods preferably made of filled
or unfilled organic polymers, filled or unfilled
inorganic-organic polymers, glass, metals or composites
and/or of combinations of above mentioned materials
40
Preparation of 3D structures by way of laser methods
[treatment of materials], wherein in particular: (a) the 3D
structures are provided for optical packages, optical
elements like micro-optics, e.g. lenses, diffractive optical
elements, MEMS/MOEMS, actors, biochips, microfluidic cells,
(tissue) scaffolds and implants like cochlea implants and
for the preparation of masks, or their preparation is made
in connection with such elements, including structures for
the nano-imprint lithography, or (b) safety structures are
prepared, inter alia for bank notes or credit cards, or (c)
by preparation of the structures a surface refinement of
existing surfaces is performed, inter alia for
watches/clocks or pictures/images; preparation of
waveguide-containing products [treatment of materials],
preferably in a scale of from sub-nm via micrometer to cm
scale or scope on surfaces of unlimited size and form,
wherein the preparation of all products is preferably made
by way of laser technique; preparation of three-dimensional
products from organic or inorganic-organic polymers
[treatment of materials], preferably at a scale of from
sub-nm via micrometer to cm scale or scope on surfaces of
unlimited size and form, wherein the preparation of all
products is preferably made by way of laser technique
42
Chemistry services, physics services, engineering services;
electronic and optical data storage; technical and
mechanical research; research and development in respect to
new products for others; construction drafting; technical
project studies; scientific research, specifically: (a) for
the production and development of products containing wave
guides, specifically of optical packages, optical elements
like micro-optics, e.g. lenses, diffractive optical
elements, MEMS/MOEMS, wherein the preparation of all the
said products is preferably performed by way of laser
technology, (b) for the production and development of
actors, biochips, microfluidic cells, (tissue) scaffolds and
implants like cochlea implants, masks, inter alia of
structures for the nano-imprint lithography, refinement
structures, inter alia for watches/clocks or
pictures/images, safety structures, inter alia for bank
notes or credit cards, wherein the preparation of all the
said products is preferably performed by way of laser
technology, and (c) for the production and development of
three-dimensional products made of organic or
inorganic-organic polymers, ceramic-material, glass or metal
in a scale from sub nm via micrometer to cm scale or scope,
respectively, in 1D, 2D or 3D on surfaces of unlimited size
and form, wherein the preparation of all the said products
is preferably performed by way of laser technology or other
light-based processes, also in combination with classic 3D
printing, using thermoplastics and/or filled or unfilled
organic polymers, filled or unfilled inorganic-organic
polymers, glass, metals or composites and/or combinations of
above mentioned materials
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