Litho DILL 3D

WIPO WIPO 2016

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Die Internationale Marke Litho DILL 3D wurde als Bildmarke am 09.11.2016 bei der Weltorganisation für geistiges Eigentum angemeldet.

Logodesign (Wiener Klassifikation)

#Quadrilateralen #Andere geometrische Figuren, undefinierbare Designs #Briefe, die eine besondere Form des Schreibens darstellen #Zahlen, die eine besondere Form der Schrift darstellen #Farben #Andere unregelmäßige Parallelogramme, Trapezien und Vierecke, Vierecke mit einer oder mehreren abgerundeten Ecken #Ein Viereck #Vierecke mit anderen figurativen Elementen #Vierecke mit einer oder mehreren Ziffern #Quadrilaterale, die einen oder mehrere Buchstaben enthalten #Quadrilaterale mit dunklen Flächen oder Teilen von Flächen #Briefe, die von einem Zeichen unverhältnismäßiger Größe überragt werden #Buchstaben, die mit einem figurativen Element verbunden sind #Serie von Briefen, die verschiedene Formen des Schreibens darstellen #Buchstabenreihen in verschiedenen Dimensionen #Zahlen, die einem Buchstaben oder einem Bildelement gegenübergestellt oder mit diesem verbunden sind #Zwei vorherrschende Farben

Markendetails Letztes Update: 03. Oktober 2019

Markenform Bildmarke
Aktenzeichen 1359003
Registernummer 302016104363
Länder Europäische Gemeinschaft Japan Südkorea Singapur Vereinigte Staaten von Amerika (USA) China
Basismarke DE Nr. 30 2016 104 363, 26. Oktober 2016
Anmeldedatum 09. November 2016
Ablaufdatum 09. November 2026

Markeninhaber

Friedrich-Bergius-Ring 15
97076 Würzburg
DE

Markenvertreter

Maximilianstraße 54 80538 München DE

Waren und Dienstleistungen

07 Machines, namely machine tools; machines and other devices/equipment, other than hand operated, in each case for the preparation of three-dimensional (3D) structures by way of laser methods, inter alia for optical packages, optical elements like micro-optics, e.g. lenses, diffractive optical elements, MEMS/MOEMS, actors, biochips, microfluidic cells, (tissue) scaffolds, implants like cochlea implants, masks, inter alia for the preparation of structures for the nano-imprint lithography, refinement structures, inter alia for watches/clocks or pictures/images, safety structures, inter alia for bank notes or credit cards, wherein the said machines and other devices/equipment, other than hand operated, for the preparation of three-dimensional (3D) structures by way of laser methods are specifically, but not necessarily equipped with software suitable for the said structures and/or may comprise integrated modules for exposure (imaging) and/or coating tasks; all aforementioned machines and other devices/equipment preferably in the form of modular devices; 3D printers, preferably in the form of modular devices
09 Scientific, surveying, photographic, optical, measuring, signalling, checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, storing, regulating and controlling of electricity or light; magnetic data carriers; digital data carriers; instruments or sensors for the exact optical detection of the position of pre-manufactured and/or assembled elements, components, or modules; lasers for industrial and scientific properties: lasers for measuring purposes; chips [integrated circuits]; optical apparatus and instruments; optical data carriers; optical fiber cables; optical fibers [light conducting filaments]; optical condensers; optical lamps; optical lenses; optical discs [data processing]; optical mirrors, optical glass; physical apparatus and instruments; prisms [optics]; refractors; scanners; switches; switches [circuit breakers]; silicon disks for integrated circuits; connectors [electricity], also optical; optical, electric and electro-optical contacts; optical conductors; printed circuit boards; objectives [optics]; optical electronic parts; optical filters; optical couplings; optical light beam deflectors; optical scanners; optical switches; optical transmitters; optical data lines; optical transmitters for use with light conducting cables; optical sensors; optical splice connector elements; optical connectors; connecting sleeves for optical fibers; all above mentioned goods preferably made of filled or unfilled organic polymers, filled or unfilled inorganic-organic polymers, glass, metals or composites and/or of combinations of above mentioned materials
40 Preparation of 3D structures by way of laser methods [treatment of materials], wherein in particular: (a) the 3D structures are provided for optical packages, optical elements like micro-optics, e.g. lenses, diffractive optical elements, MEMS/MOEMS, actors, biochips, microfluidic cells, (tissue) scaffolds and implants like cochlea implants and for the preparation of masks, or their preparation is made in connection with such elements, including structures for the nano-imprint lithography, or (b) safety structures are prepared, inter alia for bank notes or credit cards, or (c) by preparation of the structures a surface refinement of existing surfaces is performed, inter alia for watches/clocks or pictures/images; preparation of waveguide-containing products [treatment of materials], preferably in a scale of from sub-nm via micrometer to cm scale or scope on surfaces of unlimited size and form, wherein the preparation of all products is preferably made by way of laser technique; preparation of three-dimensional products from organic or inorganic-organic polymers [treatment of materials], preferably at a scale of from sub-nm via micrometer to cm scale or scope on surfaces of unlimited size and form, wherein the preparation of all products is preferably made by way of laser technique
42 Chemistry services, physics services, engineering services; electronic and optical data storage; technical and mechanical research; research and development in respect to new products for others; construction drafting; technical project studies; scientific research, specifically: (a) for the production and development of products containing wave guides, specifically of optical packages, optical elements like micro-optics, e.g. lenses, diffractive optical elements, MEMS/MOEMS, wherein the preparation of all the said products is preferably performed by way of laser technology, (b) for the production and development of actors, biochips, microfluidic cells, (tissue) scaffolds and implants like cochlea implants, masks, inter alia of structures for the nano-imprint lithography, refinement structures, inter alia for watches/clocks or pictures/images, safety structures, inter alia for bank notes or credit cards, wherein the preparation of all the said products is preferably performed by way of laser technology, and (c) for the production and development of three-dimensional products made of organic or inorganic-organic polymers, ceramic-material, glass or metal in a scale from sub nm via micrometer to cm scale or scope, respectively, in 1D, 2D or 3D on surfaces of unlimited size and form, wherein the preparation of all the said products is preferably performed by way of laser technology or other light-based processes, also in combination with classic 3D printing, using thermoplastics and/or filled or unfilled organic polymers, filled or unfilled inorganic-organic polymers, glass, metals or composites and/or combinations of above mentioned materials
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen

Markenhistorie

Datum Belegnummer Bereich Eintrag
29. August 2019 2019/40 Gaz SG RAW: Rule 18ter(2)(ii) GP following a provisional refusal
26. November 2018 2018/48 Gaz KR Ablehnung
31. Oktober 2018 2018/44 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
04. Juli 2018 2018/29 Gaz CN Ablehnung
21. Juni 2018 2018/32 Gaz JP RAW: Rule 18ter(2)(ii) GP following a provisional refusal
10. Mai 2018 2018/19 Gaz KR Ablehnung
22. Februar 2018 2018/8 Gaz JP Ablehnung
12. Januar 2018 2018/3 Gaz EM Ablehnung
11. Dezember 2017 2017/50 Gaz SG Ablehnung
18. August 2017 2017/34 Gaz US Ablehnung
09. November 2016 2017/30 Gaz DE Eintragung

ID: 141359003