BOND MEISTER

WIPO WIPO 2011

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The International trademark BOND MEISTER was filed as Figurative mark on 11/16/2011 at the World Intellectual Property Organization.

Trademark Details Last update: September 21, 2022

Trademark form Figurative mark
File reference 1100186
Countries China European Community South Korea
Base trademark JP No. 2011-041927, June 16, 2011
Application date November 16, 2011
Expiration date November 16, 2031

Trademark owner

130, Rokujizo,
Ritto-shi
JP

Trademark representatives

Avenida Fotógrafo Francisco Cano, 91A E-03540 Alicante ES

goods and services

07 Machines for manufacturing semiconductors; semiconductor wafer processing machines

Trademark history

Date Document number Area Entry
October 28, 2021 2021/46 Gaz Extension
December 31, 2019 2020/2 Gaz US RAW: Total Invalidation
April 2, 2015 2015/18 Gaz CH Rejection
April 17, 2013 2013/16 Gaz KR RAW: Rule 18ter(2)(ii) GP following a provisional refusal
February 8, 2013 2013/7 Gaz US RAW: Rule 18ter(2)(i) GP following a provisional refusal
December 19, 2012 2013/2 Gaz CH Rejection
October 24, 2012 2012/43 Gaz EM Rejection
October 1, 2012 2012/40 Gaz CN Rejection
August 9, 2012 2012/32 Gaz KR Rejection
March 8, 2012 2012/10 Gaz US Rejection
November 16, 2011 2011/49 Gaz JP Registration
Partial deletion

ID: 141100186