39
Packaging articles to the order and specification of others, namely, packaging semiconductor chips and integrated circuits
40
Etching of semiconductor wafers; Etching of integrated circuits; Manufacturing services for others in the field of semiconductors by wafer-level processing; Manufacturing services for others in the field of semiconductors by using wafer fabricating equipment; Custom manufacturing of semiconductor substrates; Custom manufacture semiconductor devices using substrate fabricating equipment; Manufacturing of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers in accordance with customer specifications
42
Research and development for others of semiconductor related products and technology; Semiconductor packaging design; Integrated circuit design for others; Design for others of semiconductor substrates carrying integrated circuit; Testing for of semiconductors and related products; Quality management services, namely, quality evaluation and analysis, quality assurance, and quality control, in the field of semiconductors and related products; Providing quality assurance services in the field of semiconductors and related products
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