USPTO USPTO 2004 SECTION 71 ACCEPTED

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The US trademark was filed as Figurative mark on 09/08/2004 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 05/02/2006. The current status of the mark is "SECTION 71 ACCEPTED".

Trademark Details

Trademark form Figurative mark
File reference 79010822
Register number 3087840
Application date September 8, 2004
Publication date February 7, 2006
Entry date May 2, 2006

Trademark owner

2-chome, Ota-ku
Tokyo 143-8580
JP

Trademark representatives

goods and services

7 cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; * POLISHING MACHINE FOR SEMICONDUCTOR, GLASS AND CERAMIC WAFERS; * metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; * MACHINE POLISHING TOOLS FOR POLISHING MACHINES * [ chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ]

ID: 1379010822