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THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; ELECTRICALLY CONDUCTING PASTES
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METAL MATRIX COMPOSITE MATERIALS AND METAL-CERAMIC COMPOSITE MATERIALS FOR MANUFACTURING USE IN THE ELECTRONICS INDUSTRY
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COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO-CHANNEL COOLERS FOR USE IN MICROPROCESSORS, HIGH PERFORMANCE COOLERS FOR MICROPROCESSORS, COOLERS FOR PERSONAL COMPUTER HOUSINGS; COOLERS FOR LASER DIODES; THERMALLY CONDUCTING INTERFACE MATERIALS FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS ON A CIRCUIT BOARD; HEAT SINKS FOR USE IN ELECTRONIC COMPONENTS; HEAT STRADDLERS FOR USE IN THE ELECTRONIC FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; COPPER COATED ALUMINUM OXIDE SUBSTRATES COPPER COATED ALUMINUM NITRIDE SUBSTRATES AND INSULATING MATERIALS PROVIDED WITH CURRENT CONDUCTORS, ALL FOREGOING GOODS FOR USE IN INTEGRATED CIRCUITS
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