MULTIBOND

USPTO USPTO 2002 ABANDONED - AFTER EX PARTE APPEAL

Protect this trademark from copycats!

With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.

The US trademark MULTIBOND was filed as Word mark on 07/01/2002 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - AFTER EX PARTE APPEAL".

Trademark Details

Trademark form Word mark
File reference 78140227
Application date July 1, 2002

Trademark owner

One Technology Way
02062 Norwood
US

Trademark representatives

goods and services

9 multilayered silicon wafers for the production of MEMS devices and integrated circuits

ID: 1378140227