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Machines for printing, patterning, additive patterning, digital printing, masking, stamping, embossing, subtractive patterning, digital photo-patterning; machinery for manufacturing electronic components, semiconductor components, devices, and systems; semiconductor manufacturing machines; chip packaging machines for electronic components, semiconductor components, devices, and systems; power-operated machine tools for stamping and embossing; power-operated machines, namely, extrusion coaters, spin coaters, spray coaters and vapor coaters; power-operated fluidic dispensing machines for ink delivery and for manufacturing electronic components, semiconductor components, devices, and systems; power-operated spin coating machines for manufacturing electronic components, semiconductor components, devices, and systems; power-operated film deposition machines
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