RELIA-SELECT

USPTO USPTO 2007 ABANDONED - NO STATEMENT OF USE FILED

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The US trademark RELIA-SELECT was filed as Word mark on 08/03/2007 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".

Trademark Details Last update: June 7, 2018

Trademark form Word mark
File reference 77247009
Application date August 3, 2007
Publication date January 29, 2008

Trademark owner

8248 Randolph Road NE
98837 Moses Lake
US

Trademark representatives

goods and services

1 Chemicals for use in selective electroless metal deposition process for cladding of copper interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; chemicals for use in photo-selective metal deposition process to fabricate metal patterns in the manufacture of semiconductor and electronic devices; precision analytical chemicals for use in analysis of chemicals in selective electroless metal process

ID: 1377247009