UNOVIS Logo (USPTO, 20.09.2006)
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Die US-Marke UNOVIS wurde als Wort-Bildmarke am 20.09.2006 beim Amerikanischen Patent- und Markenamt angemeldet.
Sie wurde am 25.03.2008 im Markenregister eingetragen.
Der aktuelle Status der Marke ist "CANCELLED - SECTION 8".
| Markenform | Wort-Bildmarke |
| Aktenzeichen | 77003131 |
| Registernummer | 3402357 |
| Anmeldedatum | 20. September 2006 |
| Veröffentlichungsdatum | 25. September 2007 |
| Eintragungsdatum | 25. März 2008 |
Markeninhaber
P.O. Box 825
139020825 Binghamton
US
139020825 Binghamton
US
Markenvertreter
Waren und Dienstleistungen
7
Electronics assembly machines that complement and enhance standard surface mount equipment for the automotive, component assembly, telecommunications, and medical markets, namely, semiconductor manufacturing machines, component and printed circuit board assembly machines in the nature of manufacturing machines for performing one or more of the following functions, namely, orienting, feeding, mounting and bonding electronic semiconductor components together and onto printed circuit boards, semiconductor wafer processing machines and semiconductor substrates manufacturing machines; semiconductor manufacturing machines featuring component and die feeders, conveyors, process peripherals and flexible process cells; semiconductor manufacturing machines for use in flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment
9
Electrical controllers and computer software for use in controlling electronics and semiconductor component assembly machines, all for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer software for determining optimum processes for assembling electronics and semiconductor components, for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer based apparatus for designing the layout of electronic circuits; electrical controllers and computer software for use in controlling semiconductor manufacturing machines that perform flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment
40
Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly
42
Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment
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ID: 1377003131