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The US trademark INTERBOND was filed as Word mark on 06/12/2000 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 76068207 |
| Application date | June 12, 2000 |
| Publication date | February 5, 2002 |
Trademark owner
7585 IRVINE CENTER DRIVE, SUITE 100
92618 IRVINE
US
92618 IRVINE
US
Trademark representatives
goods and services
9
INTEGRATED CIRCUITS, SEMICONDUCTORS, SILICON WAFERS, SILICON-ON-INSULATOR WAFERS
40
CUSTOM MANUFACTURE OF INTEGRATED CIRCUITS, SEMICONDUCTORS, SILICON WAFERS, SILICON-ON-INSULATOR WAFERS TO THE ORDER AND SPECIFICATION OF OTHERS
ID: 1376068207