SANYO PLASTICS COMPOUND AMERICA

USPTO USPTO 1999 ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE

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The US trademark SANYO PLASTICS COMPOUND AMERICA was filed as Word mark on 08/10/1999 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".

Trademark Details Last update: May 12, 2018

Trademark form Word mark
File reference 75772354
Application date August 10, 1999

Trademark owner

2320 Paseo de las Americas
92173 Otay Mesa
US

Trademark representatives

goods and services

1 Chemical products, namely, plastics, resins, colorants, pigments, rubbers, nylons, olefins, polymers, copolymers, carbohydrates, plasticizers, dyes, styrene acrylonitrile, polypropylene, polyesters, acrylonitrile butadiene-styrene (AB 5), cellulose and cellulose derivatives for use in the science, photography, horticultural and forestry industries; synthetic resins in their raw form for use in food labeling and packaging, semiconductor, electronics, fire protection and insulation, automotive, medical, garment, computer hardware, chemical, mining, waste disposal, and environmental industries; plastic materials in their raw form for use in for use in the food labeling and packaging, semiconductor, electronics, fire protection and insulation, automotive, medical, garment, computer hardware, chemical, mining, waste disposal, and environmental industries; fertilizer for agricultural, agrochemical, sustained release, and domestic use; fire extinguishing compounds; tempering, chemicals for malleability and soldering of metals; chemical products, namely, antioxidants, antimycotics, nitrates, nitrites, ascorbic acid, butylated hydrozyanisole, butylated hydroxytoluene, citric acid, sulfites, tertiary butylhydroquinone, tocopherols, acetic acid, benzoic acid, natamycin, nisin, propionic acid, sorbic acid, and sulfur dioxide and sulfites for use in food preservation; curing materials for use in synthetic resins, rubbers, plastics, plasticizers, polymers and copolymers; and adhesives for use in stamp, food labeling and packaging, semiconductor, electronics, fire protection and insulation, automotive, medical, garment, computer hardware, chemical, mining, waste disposal, and environmental industries in

ID: 1375772354