DI PAK THE FUTURE OF CERAMIC PACKAGING Logo (USPTO, 10/09/1997)
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The US trademark DI PAK THE FUTURE OF CERAMIC PACKAGING was filed as Word and figurative mark on 10/09/1997 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word and figurative mark |
| File reference | 75370818 |
| Application date | October 9, 1997 |
| Publication date | November 30, 1999 |
Trademark owner
2777 Route 20 East
13035 Cazenovia
US
13035 Cazenovia
US
Trademark representatives
goods and services
9
Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof
ID: 1375370818