HI-BOND Logo (USPTO, 10/06/1995)
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The US trademark HI-BOND was filed as Word and figurative mark on 10/06/1995 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 11/24/1998.
The current status of the mark is "CANCELLED - SECTION 8".
Trademark form | Word and figurative mark |
File reference | 75005422 |
Register number | 2204700 |
Application date | October 6, 1995 |
Publication date | September 1, 1998 |
Entry date | November 24, 1998 |
ID: 1375005422