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The Union trademark VIPack was filed as Word mark on 10/19/2022 at the European Union Intellectual Property Office.
It was registered as a trademark on 02/23/2023.
The current status of the mark is "Trademark registered".
| Trademark form | Word mark |
| File reference | 018777987 |
| Application date | October 19, 2022 |
| Publication date | November 16, 2022 |
| Entry date | February 23, 2023 |
| Expiration date | October 19, 2032 |
Trademark owner
No.26 Chin 3rd Rd. Nantze Export Processing Zone
Kaoshiung
TW
Kaoshiung
TW
Trademark representatives
Edgard Gevaertdreef 10 a
9830 Sint-Martens-Latem
BE
goods and services
9
Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circuits; Integrated circuits; Electric circuits; Printed circuit boards; Semiconductor chips; Semiconductor components; Integrated circuit boards; Wafers; Wafer bumps; Semiconductor packages, wafers [silicon slices]; substrates [wafer]
40
Etching processing of semiconductor wafers; Semiconductor packaging processing; Etching processing of integrated circuits; Semiconductor wafer-level processing; Custom manufacture of semiconductor wafers; Integrated circuit packaging processing; Substrate processing and manufacturing; Custom manufacture of semiconductor substrates; Manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer
42
Technology research and development for others in the field of Semiconductor related products; Semiconductor packaging design; Integrated Circuit design; Substrate design; Quality inspection for semiconductors and related products; Testing of semiconductors and related products; Quality identification for semiconductors and related products; Consulting with respect to semiconductor packaging technology
ID: 11018777987