TECHXIV

WIPO WIPO 2007

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The International trademark TECHXIV was filed as Figurative mark on 09/04/2007 at the World Intellectual Property Organization.

Trademark Details Last update: March 24, 2023

Trademark form Figurative mark
File reference 948576
Countries bx China Germany em Italy South Korea Singapore United States of America (USA)
Base trademark JP No. 2006-088330, September 21, 2006
Application date September 4, 2007
Expiration date September 4, 2027

Trademark owner

1-2-1 Shibaura, Minato-ku,
Tokyo 105-8634
JP

Trademark representatives

c/o Shiga International Patent Office, GranTokyo South Tower, 1-9-2, JP

goods and services

01 Silicon; silicon plates; silicon bars; polycrystal silicon; single crystal silicon ingots; semi-conductor silicon ingots; single crystal silicon ingots for integrated circuits; nonferrous metals
06 Non ferrous metal and their alloys; ingots of common metal
09 Semi-conductors; semi-conductor wafers; semi-conductor silicon wafers; crystal silicon wafers; electronic machines, apparatus and their parts; optical glass
40 Crystallizing of silicon; slicing of semi-conductor silicon ingots; slicing of single crystal silicon ingots; slicing of metal ingots; cutting of semi-conductor wafers; cutting of semi-conductor; metal cutting; grinding of semi-conductor wafers; grinding of semi-conductor; grinding of metals; polishing of semi-conductor wafers; polishing of semi-conductor; polishing of metals; grinding; abrasion; polishing; etching of semi conductor wafers; etching of semi-conductor; etching of metals; beveling of semi-conductor wafers; cleaning of semi-conductor wafers; cleaning of semi-conductor; surface treatment of semi conductor wafers by epitaxial growth; surface treatment of semi-conductor wafers by vapor deposition for forming thin films; impurity diffusion on semi-conductor wafers for forming diffusion layers; metalwork; metal treating; ceramic processing; glass processing; cutting of glass; grinding of glass

Trademark history

Date Document number Area Entry
March 13, 2023 2023/12 Gaz US Rejection
January 24, 2023 2023/5 Gaz US RAW: Rule 18ter(4) all goods and services refused
August 25, 2022 2022/44 Gaz Correction
September 4, 2017 2017/46 Gaz Extension
March 19, 2016 2016/20 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
November 2, 2015 2015/46 Gaz US RAW: Total Invalidation
October 27, 2014 2014/46 Gaz US Rejection
July 3, 2014 2014/40 Gaz JP Correction
July 7, 2009 2012/52 Gaz KR Decision on opposition
May 4, 2009 2009/23 Gaz SG RAW: Protection Granted
December 22, 2008 2008/52 Gaz EM RAW: Protection Granted
October 9, 2008 2008/43 Gaz KR Rejection
May 22, 2008 2008/21 Gaz BX RAW: Protection Granted
September 4, 2007 2008/3 Gaz JP Registration

ID: 14948576