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Die Internationale Marke HSP wurde als Wortmarke am 23.05.2023 bei der Weltorganisation für geistiges Eigentum angemeldet.
| Markenform | Wortmarke |
| Aktenzeichen | 1739176 |
| Registernummer | 6536453 |
| Länder | 
|
| Basismarke |
Nr. 6536453,
29. März 2022
|
| Anmeldedatum | 23. Mai 2023 |
| Ablaufdatum | 23. Mai 2033 |
Markeninhaber
388, Oaza Okura,
Ranzan-machi, Hiki-gun
JP
Ranzan-machi, Hiki-gun
JP
Markenvertreter
C/O SAKURAGI Patent & Trademark,
Daimon Building 4F,
JP
Waren und Dienstleistungen
01
Chemical preparations for use in the process of producing
printed circuit boards, namely, resist ink in the nature of
solder mask; chemical preparations for use in the process of
producing printed circuit boards, namely, resist ink in the
nature of photoresists; chemical preparations for use in the
process of producing printed circuit boards, namely, solder
resists; chemical preparations for solder resists used in
the process of producing printed circuit boards; chemical
preparations for use in the process of producing printed
circuit boards, namely, etching resist; chemical
preparations for use in the process of producing printed
circuit boards, namely, photoresists; chemical preparations
for use in photography; photosensitive resists in the nature
of solder mask in the form of film for use in the process of
producing printed circuit boards; dry films for use in the
process of producing electronic components; photosensitive
resists in the form of film for sealing electronic
components; thermal-curing-type dry films for use in the
process of producing electronic components; dry films
possessing electrical insulation for use in the process of
producing electronic components; chemical preparations for
blocking light; chemical coatings for use in the process of
producing printed circuit boards; chemical preparations for
resisting heat; chemical preparations for industrial
purposes; industrial chemicals; glue and adhesives for
industrial purposes; synthetic resin compositions possessing
thermal conductivity for use in the process of producing
electronic components
02
Dyestuffs; pigments; marking inks in the nature of printing
inks for use in the process of producing printed circuit
boards; marking inks for use in the process of producing
electronic components; inks for plugging hole, namely,
printing inks for use in the process of producing printed
circuit boards; printing inks for use in the process of
producing printed circuit boards; printing inks for use in
the process of producing electronic components; printing
inks, other than mimeographing inks
17
Electrical insulating resists, namely, electrical insulating
materials in liquid form for use in the process of producing
printed circuit boards; electrical insulating materials,
namely, electrical insulating synthetic resin materials for
use in the process of producing printed circuit boards;
electrical insulating synthetic resin materials possessing
thermal conductivity for use in the process of producing
electronic components; electrical insulating synthetic resin
materials for use in the process of producing electronic
components; electrical insulating synthetic resin materials
used for liquid-form electrical insulating materials
installed in an interlayer of build-up boards for use in the
process of producing build-up boards; electrical insulating
synthetic resin materials used for liquid-form electrical
insulating materials installed in an interlayer of
electronic components for sealing electronic components;
electrical insulating synthetic resin materials used for
electrical insulating materials installed in an interlayer
of build-up boards for use in the process of producing
build-up boards; electrical insulating synthetic resin
materials used for electrical insulating materials installed
in an interlayer of electronic components for sealing
electronic components; electrical insulating synthetic resin
materials used for electrical insulating materials installed
in an interlayer of a dry film for use in the process of
producing build-up boards; electrical insulating synthetic
resin materials used for electrical insulating materials
installed in an interlayer of a dry film for sealing
electronic components; electrical insulating materials,
namely, insulating coating materials for use in the process
of producing printed circuit boards; electrical insulating
materials, namely, insulating coating materials for use in
the process of producing display panels; electrical
insulating materials, namely, insulating coating materials
for copper foil protection of surface of printed circuit
boards; electrical insulating materials, namely, insulating
coating materials for use in the process of producing
package circuit boards; electrical insulating materials,
namely, insulating coating materials for use in the process
of producing flexible printed circuit boards; insulating
fillers, namely, electrical insulating materials for copper
foil protection of holes of printed circuit boards;
electrical insulating materials for sealing electronic
components in the process of producing printed circuit
boards; electrical insulating materials made of synthetic
resin for sealing electronic components in the process of
producing printed circuit boards; electrical insulating
materials; semi-processed plastics
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 23. Mai 2023 | 2023/26 Gaz | JP | Eintragung |
ID: 141739176