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Die Internationale Marke TAFCS wurde als Wortmarke am 20.01.2023 bei der Weltorganisation für geistiges Eigentum angemeldet.
| Markenform | Wortmarke |
| Aktenzeichen | 1719980 |
| Länder | 
|
| Basismarke |
Nr. 2022130489,
15. November 2022
|
| Anmeldedatum | 20. Januar 2023 |
| Ablaufdatum | 20. Januar 2033 |
Markeninhaber
388, Oaza Okura, Ranzan-machi,
Hiki-gun
JP
Hiki-gun
JP
Markenvertreter
C/O SAKURAGI Patent & Trademark,
Daimon Building 4F,
JP
Waren und Dienstleistungen
01
Photopolymerization initiators being industrial chemicals;
chemical additives in the nature of initiators for use in
the manufacture of ultraviolet light-curable inks; chemicals
for use in the process of producing printed circuit boards,
namely, resist ink in the nature of solder mask; chemicals
for use in the process of producing printed circuit boards,
namely, resist ink in the nature of photoresists; chemicals
for ink jet printing, namely, resist ink in the nature of
solder mask; chemicals for ink jet printing, namely, resist
ink in the nature of photoresists; chemicals for use in the
process of producing printed circuit boards, namely, solder
resists; chemical preparations for use in the process of
producing printed circuit boards, namely, solder mask;
dilution agents for solder resists; chemicals for use in the
process of producing printed circuit boards, namely, plating
mask; chemicals for use in the process of producing printed
circuit boards, namely, etching resist; photosensitive
resists in the nature of solder mask in the form of film for
use in the process of producing printed circuit boards;
chemicals for use in the process of producing printed
circuit boards, namely, chemical preparations for blocking
light in the color of black in the form of paste for use in
the process of forming of black matrix; chemicals for use in
the process of producing printed circuit boards, namely,
chemical preparations for blocking light; chemical coatings
for use in the process of producing printed circuit boards;
chemical coatings used in the manufacture of printed circuit
boards; chemicals for use in the process of producing
printed circuit boards, namely, chemical agents for plugging
holes on printed circuit boards; heat resisting materials,
namely, heat resisting unprocessed artificial resin for
electronic components; chemical preparations for industrial
purposes; industrial chemicals; conductive adhesives for
industrial purposes; glue and adhesives for industrial
purposes; chemicals for use in the process of producing
printed circuit boards, namely, photoresists; chemical
preparations for use in photography; resin compositions
having thermal conductivity for use in the process of
producing electronic components; plastics, unprocessed
02
Dyestuffs; pigments; paints for blocking light;
heat-resistant paints; paints; marking inks in the nature of
printing inks for use in the process of producing printed
circuit boards; inks for hole plugging, namely, printing
inks for use in the process of producing printed circuit
boards; printing inks for use in the process of producing
printed circuit boards; printing ink
05
Pharmaceutical preparations; fumigants only for agricultural
purposes; fungicides only for agricultural purposes; rat
poison; insecticides; herbicides; insect-repellents only for
agricultural purposes; antiseptics only for agricultural
purposes; adhesives for dentures; dental materials; dietary
supplements for humans; dietetic beverages adapted for
medical purposes; dietetic foods adapted for medical
purposes; dietary supplements for animals
17
Electrical insulating resists, namely, electrical insulating
materials in the liquid form for use in the process of
producing printed circuit boards; electrical insulating
materials, namely, insulating resin materials for use in the
process of producing printed circuit boards; electrical
insulating materials, namely, insulating resin materials for
interlayer dielectric materials in the liquid form for use
in the process of producing build-up boards; insulating
resin materials for interlayer dielectric materials for use
in the process of producing build-up boards; electrical
insulating materials, namely, insulating resin materials for
interlayer dielectric materials for use in the process of
producing build-up boards; electrical insulating materials,
namely, insulating coating materials for use in the process
of producing printed circuit boards; electrical insulating
materials, namely, insulating coating materials for use in
the process of producing display panels; electrical
insulating materials, namely, insulating coating materials
for protecting copper foil on the surface of printed circuit
boards; electrical insulating materials, namely, insulating
coating materials for use in the process of producing
package circuit boards; electrical insulating materials,
namely, insulating coating materials for use in the process
of producing flexible printed circuit boards; insulating
fillers, namely, electrical insulating materials for
protecting copper foil used with holes of printed circuit
boards; electrical insulating materials for sealing
electronic component in the process of producing printed
circuit boards; synthetic resin insulating materials for
sealing electronic component in the process of producing
printed circuit boards; electrical insulating materials for
use in the process of producing printed circuit boards;
semi-processed plastics
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 09. August 2023 | 2023/32 Gaz | EM | Ablehnung |
| 06. Juli 2023 | 2023/27 Gaz | CN | Ablehnung |
| 20. Januar 2023 | 2023/10 Gaz | JP | Eintragung |
ID: 141719980