RUDOLPH

WIPO WIPO 2022

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Mit unserer Markenüberwachung werden Sie automatisch per E-Mail über Nachahmer und Trittbrettfahrer benachrichtigt.

Die Internationale Marke RUDOLPH wurde als Wortmarke am 18.03.2022 bei der Weltorganisation für geistiges Eigentum angemeldet.

Markendetails Letztes Update: 17. Juli 2023

Markenform Wortmarke
Aktenzeichen 1666899
Länder China Europäische Gemeinschaft Japan Südkorea Singapur
Basismarke US Nr. 97308042, 11. März 2022
Anmeldedatum 18. März 2022
Ablaufdatum 18. März 2032

Markeninhaber

16 Jonspin Road
Wilmington MA 01887
US

Markenvertreter

2 North Riverside Plaza, Suite 1500 Chicago IL 60606 US

Waren und Dienstleistungen

07 Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine, components and operating software therefor sold as a unit for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components
09 Optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; scientific instruments, based principally upon optical microscope, electron microscope, spectrophotometer, ellipsometer and scanning slit densitometer technology, for metrology purposes, namely, apparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materials
42 Providing temporary use on online, non-downloadable process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogenous packaging, and other advanced packaging electronics technologies
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Markenhistorie

Datum Belegnummer Bereich Eintrag
13. Juli 2023 2023/28 Gaz KR Ablehnung
15. Juni 2023 2023/24 Gaz SG Ablehnung
06. April 2023 2023/15 Gaz JP Ablehnung
08. November 2022 2022/45 Gaz CN Ablehnung
03. November 2022 2022/44 Gaz EM Ablehnung
18. März 2022 2022/22 Gaz US Eintragung

ID: 141666899