09
Photonic chips; integrated circuits, including photonic
integrated circuits [PIC's]; semiconductor chips; data
processing equipment and data carriers; microcontrollers;
devices enabling the transfer of data; interfaces for
connecting chips; lasers; electric and photonic wires for
chips and integrated circuits; sensors, also in the form
photonic chips; optical apparatus, devices and instruments;
optical chips, circuits and semiconductors; fiber arrays and
fibre optic cables; spot size converters [SSC's]; parts and
components of the aforementioned products
40
Treatment of materials, namely custom assembling, packaging
and integration of photonic devices and components in
specific applications and modules; custom assembling
concerning photonic devices and instruments for and on
behalf of third parties; custom manufacturing services in
the field of photonic components and devices, including
integrated circuits [PIC's]; hybrid multi-chip assembly and
integration; polishing of PIC's; fiber placement and
photonic wire bonding on products of others; custom
manufacturing of fiber arrays; assembling of optical fiber
arrays for photonic integrated circuits [PIC's]; custom
assembling concerning semiconductors, photonic chips and
integrated circuits, including photonic integrated circuits
[PIC's]
42
Technical research and engineering services in the field of
photonics; design and development services concerning
semiconductors, photonic chips and integrated circuits,
including photonic integrated circuits [PIC's]; product
design services; engineering services concerning the
manufacture of PIC enabled modules; scientific and technical
consultancy services concerning photonic technology
solutions and photonic technology appliances; computer
programming services; scientific and technical services
concerning the evaluation, testing, design, development,
assembly and application of photonic chips, integrated
circuits, photonic interfaces and semiconductors; technical
consultancy and design services concerning the integration
of PIC's into devices and the connection of same with other
components such as optical fibers, amplifiers, electronics;
developing packaging and housing solutions for photonic
integrated circuits [PIC's]
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