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Die Internationale Marke CELLFIL wurde als Wortmarke am 22.02.2021 bei der Weltorganisation für geistiges Eigentum angemeldet.
| Markenform | Wortmarke |
| Aktenzeichen | 1597981 |
| Länder | 
|
| Basismarke |
Nr. 2020-159105,
24. Dezember 2020
|
| Anmeldedatum | 22. Februar 2021 |
| Ablaufdatum | 22. Februar 2031 |
Markeninhaber
388, Oaza Okura, Ranzan-machi,
Hiki-gun
JP
Hiki-gun
JP
Markenvertreter
C/O SAKURAGI Patent & Trademark
Daimon Building 4F,
JP
Waren und Dienstleistungen
01
Chemicals for use in the process of producing printed
circuit boards, namely, resist ink; chemicals for use in the
process of producing printed circuit boards, namely, solder
resists; chemical preparations for use in the process of
producing printed circuit boards, namely, solder mask;
dilution agents for solder resists; etching resist;
photoresists; chemical preparations for use in photography;
photosensitive resists in the form of film for use in the
process of producing printed circuit boards; photosensitive
resists in the form of film for sealing electronic
components; unexposed dry films, namely, mold dry films for
electronic components; unexposed dry films, namely,
insulation mold dry films for electronic components;
unexposed dry films, namely, thermal curing type mold dry
films for electronic components; chemical preparations for
blocking light in the color of black in the form of paste
for use in the process of forming of black matrix; chemical
preparations for blocking light; chemical coatings for use
in the process of producing printed circuit boards; chemical
coatings; chemicals for use in the process of producing
printed circuit boards, namely, chemical agents for plugging
holes on printed circuit boards; sealants for use in the
process of producing electronic components; resin sealants
for use in the process of producing electronic components;
heat resisting materials; chemical preparations for
industrial purposes; industrial chemicals; conductive
adhesives for industrial purposes; glue and adhesives for
industrial purposes
02
Dyes; pigments; paints for blocking light; marking inks for
use in the process of producing printed circuit boards;
marking inks for use in the process of producing electronic
components; hole plugging inks for use in the process of
producing printed circuit boards; paints for sealing
electronic components; heat-resistant paints; paints;
printing inks for use in the process of producing printed
circuit boards; printing inks for use in the process of
producing electronic components; printing ink
17
Electrical insulating resists in the liquid form for use in
the process of producing printed circuit boards; insulating
resin materials for use in the process of producing printed
circuit boards; insulating resin materials for use in the
process of producing electronic components; insulating resin
materials for interlayer dielectric materials in the liquid
form for use in the process of producing build-up boards;
insulating resin materials for interlayer dielectric
materials in the liquid form for sealing electronic
components; insulating resin materials for interlayer
dielectric materials for use in the process of producing
build-up boards; insulating resin materials for interlayer
dielectric materials for sealing electronic components;
insulating resin materials for interlayer dielectric
materials in the form of film for use in the process of
producing build-up boards; insulating resin materials for
interlayer dielectric materials in the form of film for
sealing electronic components; insulating coating materials
for use in the process of producing printed circuit boards;
insulating coating materials for use in the process of
producing display panels; insulating coating materials for
protecting copper foil on the surface of printed circuit
boards; insulating coating materials for use in the process
of producing package application boards; insulating coating
materials for use in the process of producing flexible
printed circuit boards; insulating fillers for protecting
copper foil used with holes of printed circuit boards;
insulating materials for sealing electronic components;
insulating resin materials for sealing electronic
components; electrical insulating materials for use in the
process of producing printed circuit boards; semi-processed
plastics
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 21. November 2022 | 2022/47 Gaz | KR | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 15. September 2022 | 2022/38 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 06. April 2022 | 2022/14 Gaz | KR | Ablehnung |
| 24. Januar 2022 | 2022/4 Gaz | CN | Ablehnung |
| 12. Oktober 2021 | 2021/41 Gaz | US | Ablehnung |
| 22. Februar 2021 | JP | Eintragung |
ID: 141597981