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Die Internationale Marke MICROSEAL wurde als Wortmarke am 22.02.2021 bei der Weltorganisation für geistiges Eigentum angemeldet.
| Markenform | Wortmarke |
| Aktenzeichen | 1596051 |
| Länder | 
|
| Basismarke |
Nr. 2020-159106,
24. Dezember 2020
|
| Anmeldedatum | 22. Februar 2021 |
| Ablaufdatum | 22. Februar 2031 |
Markeninhaber
388, Oaza Okura, Ranzan-machi,
Hiki-gun
JP
Hiki-gun
JP
Markenvertreter
C/O SAKURAGI Patent & Trademark
Daimon Building 4F,
JP
Waren und Dienstleistungen
01
Chemicals for use in the process of producing printed
circuit boards, namely, resist ink; chemicals for use in the
process of producing printed circuit boards, namely, solder
resists; chemical preparations for use in the process of
producing printed circuit boards, namely, solder mask;
dilution agents for solder resists; etching resist;
photoresists; chemical preparations for use in photography;
photosensitive resists in the form of film for use in the
process of producing printed circuit boards; photosensitive
resists in the form of film for sealing optical components;
unexposed dry films, namely, mold dry films for display;
unexposed dry films, namely, mold dry films with optical
properties; unexposed dry films, namely, insulation mold dry
films for display; unexposed dry films, namely, insulation
mold dry films with optical properties; unexposed dry films,
namely, mold dry films for display with optical properties;
chemical preparations for blocking light in the color of
black in the form of paste for use in the process of forming
of black matrix; chemical preparations for blocking light;
chemical coatings for use in the process of producing
printed circuit boards; chemical coatings; chemicals for use
in the process of producing printed circuit boards, namely,
chemical agents for plugging holes on printed circuit
boards; sealants for use in the process of producing optical
components; resin sealants for use in the process of
producing optical components; heat resisting materials;
chemical preparations for industrial purposes; industrial
chemicals; conductive adhesives for industrial purposes;
glue and adhesives for industrial purposes
02
Dyes; pigments; paints for blocking light; marking inks for
use in the process of producing printed circuit boards;
marking inks for use in the process of producing optical
components; hole plugging inks for use in the process of
producing printed circuit boards; paints for sealing optical
components; heat-resistant paints; paints; printing inks for
use in the process of producing printed circuit boards;
printing inks for use in the process of producing optical
components; printing ink
17
Electrical insulating resists in the liquid form for use in
the process of producing printed circuit boards; insulating
resin materials for use in the process of producing printed
circuit boards; insulating resin materials for use in the
process of producing optical components; insulating resin
materials for interlayer dielectric materials in the liquid
form for use in the process of producing build-up boards;
insulating resin materials for interlayer dielectric
materials in the liquid form for sealing optical components;
insulating resin materials for interlayer dielectric
materials for use in the process of producing build-up
boards; insulating resin materials for interlayer dielectric
materials for sealing optical components; insulating resin
materials for interlayer dielectric materials in the form of
film for use in the process of producing build-up boards;
insulating resin materials for interlayer dielectric
materials in the form of film for sealing optical
components; insulating coating materials for use in the
process of producing printed circuit boards; insulating
coating materials for use in the process of producing
display panels; insulating coating materials for protecting
copper foil on the surface of printed circuit boards;
insulating coating materials for use in the process of
producing package application boards; insulating coating
materials for use in the process of producing flexible
printed circuit boards; insulating fillers for protecting
copper foil used with holes of printed circuit boards;
insulating materials for sealing optical components;
insulating resin materials for sealing optical components;
electrical insulating materials for use in the process of
producing printed circuit boards; semi-processed plastics
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 21. Februar 2023 | 2023/8 Gaz | KR | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 10. Oktober 2022 | 2022/42 Gaz | US | Ablehnung |
| 28. Juli 2022 | 2022/31 Gaz | KR | Ablehnung |
| 12. Oktober 2021 | 2021/41 Gaz | US | Ablehnung |
| 04. Oktober 2021 | 2021/41 Gaz | CN | Ablehnung |
| 22. Februar 2021 | 2021/21 Gaz | JP | Eintragung |
ID: 141596051