07
Lithography machines for the manufacture of
microelectronics, integrated circuits, light emitting
diodes, and semiconductors on laminar substrates including
wafers, glass panels, and packaging panels such as copper
plate or plastic
09
Optical metrology, characterization, and inspection systems
for the production of laminar substrates including discrete
electronic components, semiconductors including non-volatile
and volatile memory devices, foundry and logic devices, asic
devices, cmos image sensors, microelectromechanical systems,
light emitting diodes, and other micro and nano technology
devices, system in package, heterogenous packaging, and
other advanced packaging electronics technologies; optical
metrology, characterization, and inspection systems for the
production of precision machined surfaces and components
including turbine blades, automotive drive train, and
related products; optical metrology, characterization, and
inspection systems for the production of precision machined
optical surfaces, optical coatings, and optical assemblies
including reference flat, sphere, asphere and assemblies
composed of both refractive and reflective components;
process control and defect analysis software for use in the
production of laminar substrates including discrete
electronic components, semiconductors including non-volatile
and volatile memory devices, foundry and logic devices, asic
devices, cmos image sensors, microelectromechanical systems,
light emitting diodes, and other micro and nano technology
devices, system in package, heterogenous packaging, and
other advanced packaging electronics technologies
42
Providing temporary use of non-downloadable software for the
process control and defect analysis for use in the
production of laminar substrates including discrete
electronic components, semiconductors including non-
volatile and volatile memory devices, foundry and logic
devices, asic devices, cmos image sensors,
microelectromechanical systems, light emitting diodes, and
other micro and nano technology devices, system in package,
heterogenous packaging, and other advanced packaging
electronics technologies
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