NEXIM

WIPO WIPO 2018

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Die Internationale Marke NEXIM wurde als Wortmarke am 02.08.2018 bei der Weltorganisation für geistiges Eigentum angemeldet.

Markendetails Letztes Update: 10. August 2023

Markenform Wortmarke
Aktenzeichen 1445603
Registernummer 5717716
Länder Europäische Gemeinschaft Indonesien Indien Südkorea Mexiko Malaysia Thailand Türkei Vereinigte Staaten von Amerika (USA) Vietnam
Basismarke JP Nr. 5717716, 14. November 2014
Anmeldedatum 02. August 2018
Ablaufdatum 02. August 2028

Markeninhaber

19, Chausuyama,
Yamamachi
JP

Markenvertreter

Marunouchi Estate Bldg., c/o KONISHI & NAKAMURA JP

Waren und Dienstleistungen

07 Automatic electronic parts mounting machines for automatically mounting electronic parts such as IC chips on printed circuit boards; automatic electronic parts insertion machines for putting electronic parts in printed circuit boards; printed board screen printers; dispensers for printed boards; adhesive curing equipment for printed boards; soldering machines for printed boards; semiconductor manufacturing machines; electronic parts feeders for semiconductor manufacturing apparatus; metalworking machine tool; turning centers; machining centers; lathes; plasma surface treatment apparatus for semiconductor substrates; plasma cleaning apparatus for semiconductor substrates; surface adhesion improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; hydrophilic nature improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; plasma cleaning machines for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; oxide film removing machines using plasma for semiconductor substrates, metal, semiconductor electronic parts and metallic automobile parts; plasma etching machines for semiconductor materials; residue removing machines using plasma for use in semiconductor substrate manufacturing process; metallic surface hardening treatment machines using plasma for improving abrasion resistance of cutting tools; surface finishing treatment machines using plasma for easier forming of prosthesis coating over the ceramic material surfaces of junctions of artificial bones or joints during their manufacturing process; automated small parts assembly equipment; automated assembly machinery for fuel cells, solar cells and other secondary batteries; automated assembly instruments for metallic parts, automobile parts, electric parts and other mechanical parts; electronic circuit card assembly equipment; electronic circuit assembly equipment; automated assembly equipment for medical instruments; industrial robots; automated storage and retrieval warehouse; AC motors and DC motors not including those for land vehicles but including parts for any AC motors and DC motors; parts and accessories of industrial robots or automated storage and retrieval warehouse; robot parts and accessories for assembly, welding, processing or transfer; inspection robots for electric/electronic parts manufacturing process
09 Electronic computers including central processing units, electronic circuits and magnetic discs recorded with computer programs, other computer peripherals; computer programs (recorded); computer programs for use in manufacturing printed circuit board (recorded); recording media recorded with computer programs for printed circuit board assembly line management; recording media recorded with computer programs for supporting creation of job data and component data of printed circuit board; recording media recorded with computer programs for editing circuit-board layout of printed circuit board; recording media recorded with computer programs for managing in manufacturing of printed circuit board with a function to create a format of International standard computer program; recording media recorded with computer programs for diagnosing/modifying computer programs of printed circuit board manufacturing control; recording media recorded with computer programs for managing job data and component data of printed circuit board; recording media recorded with computer programs for managing manufacturing process of printed circuit board assembling lines; recording media recorded with computer programs for preparing printed circuit board manufacturing reports
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen

Markenhistorie

Datum Belegnummer Bereich Eintrag
08. August 2023 2023/32 Gaz KR Ablehnung
20. Dezember 2022 2022/51 Gaz TR Ablehnung
20. Mai 2022 2022/30 Gaz JP Korrektur
25. März 2021 2021/13 Gaz MX RAW: Rule 18ter(2)(i) GP following a provisional refusal
17. November 2020 2020/47 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
09. Dezember 2019 2019/51 Gaz IN RAW: Rule 18ter(2)(ii) GP following a provisional refusal
13. September 2019 2020/6 Gaz MX Ablehnung
26. Juni 2019 2019/27 Gaz EM Ablehnung
23. Februar 2019 2019/9 Gaz US Ablehnung
05. Februar 2019 2019/7 Gaz IN Ablehnung
02. August 2018 JP Eintragung

ID: 141445603