soitec Logo (WIPO, 30.11.2016)
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Die Internationale Marke soitec wurde als Bildmarke am 30.11.2016 bei der Weltorganisation für geistiges Eigentum angemeldet.
Logodesign (Wiener Klassifikation)
#Buchstaben oder Ziffern, die geometrische Figuren bilden, Schrift- oder typografische Gegenstände in perspektivischer Darstellung #Briefe, die eine besondere Form des Schreibens darstellen #Farben #Buchstaben oder Ziffern, die eine Ellipse bilden (Fläche oder Peripherie) #Drei vorherrschende Farben
| Markenform | Bildmarke |
| Aktenzeichen | 1338104 |
| Registernummer | 4275963 |
| Länder | 
|
| Basismarke |
Nr. 4275963,
23. September 2016
|
| Anmeldedatum | 30. November 2016 |
| Ablaufdatum | 30. November 2026 |
Markeninhaber
Parc Technologique des Fontaines,
Chemin des Franques
FR
Chemin des Franques
FR
Markenvertreter
20 rue de Chazelles
F-75847 PARIS CEDEX 17
FR
Waren und Dienstleistungen
09
Semiconductor substrates for opto-electronics, for
micro-electronics, micro-engineering and derived activities;
semi-conductor wafers; semi-conductors; silicon wafers and
semiconductors for integrated circuits and derived
activities; semiconductor wafers for light-emitting diodes,
radio frequency (RF) components and for power components;
substrates for micro-electronics, opto-electronics and
micro-engineering, for flat screens, light-emitting diodes,
micro-systems, photovoltaics, integrated optical guides,
sensors, storage, integrated circuits, radio frequency (RF)
and power components
40
Treatment of materials, namely mechanical, physical and
chemical treatment and machining, gluing of material
surfaces; treatment of substrates for micro-electronics,
opto-electronics and micro-engineering, photovoltaics,
microsystems and radio frequency (RF) components and all
derived activities; treatment of semiconductor wafers and
semiconductors; polishing of semiconductor wafers, transfer
of layers of materials, semiconductors or components on all
media; treatment of silicon wafers and semiconductors;
polishing of silicon wafers and semiconductors, transfer of
silicon layers, semiconductors or components on all media
42
Scientific, technological, technical and industrial research
provided by engineers; testing of materials; laboratory
work for others, namely materials testing and research and
development; research and development of new products for
others; research and development in the field of wafers and
semiconductors for opto-electronic components,
photovoltaics, radio frequency (RF) components, power
components, micro-engineering, micro-systems, storage and
derived activities; research and development in the field of
silicon wafers and semiconductors for integrated circuits
and derived activities; research and development in the
field of the transfer of micro-electronic circuits or
micro-systems on all media and derived activities;
engineering and engineering services in the field of
semiconductor wafers and semiconductors for
micro-electronic, opto-electronic, radio frequency (RF),
micro-mechanical, photovoltaic components, storage
components, power components and derived activities;
engineering and expertise (engineering work), in the field
of silicon wafers and semiconductors for integrated circuits
and derived activities and the transfer of micro-electronic
or opto-electronic circuits or micro-systems on all types of
media and derived activities; research for the development
of new products in the field of semiconductor wafers for the
manufacture of electronic devices, for the manufacture of
transistors, memories, diodes, photodiodes, light-emitting
diodes, photodiode detectors, radio frequency (RF)
components and micro-systems; assistance and technical
support, namely technical advice for the development of new
products in the field of semiconductor wafers for the
manufacture of electronic devices, for the manufacture of
transistors, diodes, photodiodes, light-emitting diodes,
photodiode detectors, radio frequency (RF) components and
micro-systems
Die Bezeichnungen wurden automatisch übersetzt. Übersetzung anzeigen
Markenhistorie
| Datum | Belegnummer | Bereich | Eintrag |
|---|---|---|---|
| 18. Juni 2019 | 2019/25 Gaz | KR | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 29. Dezember 2018 | 2019/1 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 14. November 2018 | 2018/47 Gaz | CN | Ablehnung |
| 04. September 2018 | 2018/43 Gaz | IL | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 09. Mai 2018 | 2018/20 Gaz | Korrektur | |
| 06. Februar 2018 | 2018/8 Gaz | CN | Ablehnung |
| 05. Februar 2018 | 2018/7 Gaz | IL | Ablehnung |
| 25. Januar 2018 | 2018/6 Gaz | JP | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| 05. Dezember 2017 | 2017/49 Gaz | KR | Ablehnung |
| 22. November 2017 | 2018/4 Gaz | RU | Ablehnung |
| 06. November 2017 | 2017/49 Gaz | IN | Ablehnung |
| 22. September 2017 | 2017/38 Gaz | SG | Ablehnung |
| 08. September 2017 | 2017/37 Gaz | EM | Ablehnung |
| 20. Juli 2017 | 2017/29 Gaz | JP | Ablehnung |
| 26. April 2017 | 2017/17 Gaz | US | Ablehnung |
| 30. November 2016 | FR | Eintragung |
ID: 141338104