OERLIKON ESEC

USPTO USPTO 2008 IR CANCELED; US APPLICATION ABANDONED

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Die US-Marke OERLIKON ESEC wurde als Bildmarke am 06.02.2008 beim Amerikanischen Patent- und Markenamt angemeldet. Der aktuelle Status der Marke ist "IR CANCELED; US APPLICATION ABANDONED".

Markendetails

Markenform Bildmarke
Aktenzeichen 79054490
Anmeldedatum 06. Februar 2008

Markeninhaber

Waren und Dienstleistungen

7 Machines for the manufacture of products for information technology, in particular in the fields of semiconductors, data stores, flat panel displays and optical components, namely, semiconductor manufacturing machines, semiconductor wafer processing machines; vacuum pumps being machines, namely for the semiconductor industry; machines for semiconductor production, namely, semiconductor manufacturing machines; machines for manufacturing and assembling semiconductor chips; thin film production machines, namely, machines for applying thin-film coatings in semiconductor manufacturing processes; machines for coating and etching semiconductor devices; machines for the assembly of semiconductor devices; machines for the manufacture of electrical connections in semiconductor devices; apparatus for applying coating to optical and magnetic data carriers; machines for the manufacture of components of semiconductors, namely, electrical connections between chips and carrier substrate, as well as for flip-chip assembly
9 Apparatus for the automatic control and monitoring of production lines, namely, computer software to monitor and control factory manufacturing processes, computer software and hardware for monitoring, checking and supervision purposes; measuring and analysis apparatus for the semiconductor industry, namely, scientific instruments, namely electronic analyzers for measuring and testing in the semiconductor industry; electrical, electronic and computer-assisted controllers for the semiconductor industry for use in chip assembly equipment and in processing techniques related to chip assembly equipment; computer software for semiconductors; hybrid circuits, namely, integrated circuits; circuit boards with or without mounting; semiconductor components, namely, transistors, rectifiers, integrated circuits and other electronic components, in particular those manufactured from polycrystalline silicon and silicon starting materials, namely, silicon chips, silicon wafers; electronic components for use in computers, mobile phones, televisions, DVD players, automotive and industrial electronics, PDA's, televisions, electronic sensors and smart cards; wafers being silicon slices for integrated circuits; glass wafers being glass slices for integrated circuits; ingots being blocks of semiconductor material; semiconductors; integrated circuits
42 Scientific and industrial research in the field of information and telecommunications technology, semiconductors and wafers as well as the field of chip assembly equipment; providing of expert opinions, namely, drawing up of expert technical opinions in connection with semiconductors; technical consultancy in the field of information and telecommunications technology, semiconductors and wafers as well as the field of chip assembly equipment and providing of chemistry, namely, chemistry consultation; engineering; consultation in the field of physics; design and development of computer hardware and software
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ID: 1379054490