Logo (USPTO, 15.11.2002)
USPTOSchützen Sie diese Marke vor Nachahmern!
Mit unserer Markenüberwachung werden Sie automatisch per E-Mail über Nachahmer und Trittbrettfahrer benachrichtigt.
Die US-Marke wurde als Bildmarke am 15.11.2002 beim Amerikanischen Patent- und Markenamt angemeldet.
Sie wurde am 26.10.2004 im Markenregister eingetragen.
Der aktuelle Status der Marke ist "CANCELLED - SECTION 8".
| Markenform | Bildmarke |
| Aktenzeichen | 76469471 |
| Registernummer | 2897804 |
| Anmeldedatum | 15. November 2002 |
| Veröffentlichungsdatum | 27. Januar 2004 |
| Eintragungsdatum | 26. Oktober 2004 |
Markeninhaber
Fuhsing 3 Road, Kueishan
Taoyuan
TW
Taoyuan
TW
Markenvertreter
Waren und Dienstleistungen
35
Retail store services featuring semiconductors, wafers and integrated circuits; providing business information in the field of establishing and operating semiconductors, wafers and integrated circuit businesses; computerized on-line retail services via the global communication network providing Chinese input and display units, chips, negative masks, network cards, circuit boards, semiconductors, interface cards for the computer, micro computers, integrated circuits, printed circuit boards, laminates, integrated circuit pins; computerized on-line retail services via the global communication network providing computers and computer peripherals; packaging wafers, chips, semiconductors and integrated circuits to the order and specification of others, and packaging of masks to the order and specification of others
40
Assembly of wafers, chips, semiconductors and integrated circuits for others; assembly of integrated circuits, masks, and electronic chips or computer chips for others; custom cutting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom photo lithograph printing of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom etching of wafers, chips, semiconductors and integrated circuits; custom thin filming of wagers, chips, semiconductors and integrated circuits to the order and specification of others; custom diffusion ion implanting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom chemical mechanical polishing of wafers, chips, semiconductors and integrated circuits to the order and specification of others
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ID: 1376469471