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The US trademark CU.P BUMP was filed as Word mark on 01/22/2002 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 76360995 |
| Application date | January 22, 2002 |
| Publication date | September 14, 2004 |
Trademark owner
#03-01/03
739256 Singapore
SG
739256 Singapore
SG
Trademark representatives
goods and services
9
conductive interconnect components, containing copper, on and extending from, an integrated circuit or semiconductor wafer, flip chip interconnect components, namely, flip chip on lead frames, flip chip on substrates and micro electromechanical systems; pillar bump components, namely, wafer level chips skill package and micro electromechanical systems; integrated circuit interconnect components, namely, chip on chip components for micro electromechanical systems
40
Custom manufacture of bumps, namely conductive material, including copper, on an integrated circuit or semiconductor wafter; custom semiconductor bumping services; custom electroplating of conductive material on integrated circuits or semiconductor wafers; custom pillar bumping services
ID: 1376360995