ADVANCED THERMAL SOLUTIONS

USPTO USPTO 2000 ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE

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Die US-Marke ADVANCED THERMAL SOLUTIONS wurde als Wortmarke am 07.01.2000 beim Amerikanischen Patent- und Markenamt angemeldet. Der aktuelle Status der Marke ist "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".

Markendetails Letztes Update: 30. Juli 2019

Markenform Wortmarke
Aktenzeichen 75892601
Anmeldedatum 07. Januar 2000

Markeninhaber

89 Access Road, Suite #25
02062 Norwood.
US

Markenvertreter

Waren und Dienstleistungen

9 Scientific equipment and computers for use in thermal management, namely dissipaters for use as a component part in scientific equipment and computers; fans, vortex generators, turbulators, baffles, and guide vanes for use as component parts in computers and scientific equipment; air and liquid cooled heat sinks for use in computers and scientific equipment, for dissipating heat and regulating thermal conditions in computers and scientific equipment; heat exchangers, heat spreaders, heat pipes, thermo-syphons, vapor-chambers, cold plates, thermo-electric/peltier cells, phase change materials, all for use in computers and scientific equipment; scientific instruments for use in development and design of thermal management products, namely flow phenomena visualization devices and equipment, wind tunnels, ovens, still air enclosures, cold plates, liquid crystal thermal imaging devices, and velocity and temperature measuring devices, namely shadowgraph devices, schlieren devices, interferometry devices, halographic interferometry devices, particle image velocimetry devices, laser doppler velocimetry/anemometry devices, liquid crystal imaging devices, infra-red devices, manometer devices, pitot tube devices, pitot-static tube devices, orifice plate devices, pressure transducers, hot wire anemometers, thermocouple devices, resistance temperature detectors, resistance thermometers, thermistors, thermal test dies, heat flux gages, clorimeters, thermopiles, shear stress gauges, strain gages, and long bars; computer software for use in analyzing data used in performing parametric studies; computer software for use in performing parametric studies, and for use in selecting thermal management products; computer software for use in thermal analysis of electronic equipment, conduction solving, fluid flow solving, flow resistor networks, thermal resistor networks, PCB simulators, heat sink and PCB calculators, and spreading resistance calculators
42 Technical consultation in the field of thermal management for use with electronic components; testing and design of new products for others, namely testing and design of thermal management products for use with electronic components and board and system components
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ID: 1375892601