HI-BOND

USPTO USPTO 1995 CANCELLED - SECTION 8

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The US trademark HI-BOND was filed as Word and figurative mark on 10/06/1995 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 11/24/1998. The current status of the mark is "CANCELLED - SECTION 8".

Trademark Details Last update: May 2, 2018

Trademark form Word and figurative mark
File reference 75005422
Register number 2204700
Application date October 6, 1995
Publication date September 1, 1998
Entry date November 24, 1998

Trademark owner

35 De Havilland Road, Mordialloc
Victoria 3195
AU

Trademark representatives

goods and services

7 machines for building and repairing brakes and for bonding brake linings to brake assemblies
12 brakes, brake linings, and brake shoes for use on land vehicles

ID: 1375005422