STPay-Mobile

EUIPO EUIPO 2023 Trademark registered

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The Union trademark STPay-Mobile was filed as Word mark on 07/10/2023 at the European Union Intellectual Property Office.
It was registered as a trademark on 03/05/2024. The current status of the mark is "Trademark registered".

Trademark Details Last update: April 17, 2024

Trademark form Word mark
File reference 018898931
Application date July 10, 2023
Publication date November 27, 2023
Entry date March 5, 2024
Expiration date July 10, 2033

Trademark owner

Chemin du Champ-des-Filles 39
1228 Plan-les-Ouates, Geneva
CH

Trademark representatives

Plaza de los Luceros, 17 8º Oficinas 03004 Alicante ES

goods and services

9 Chips [ integrated circuits]; electric or electronic components, namely semiconductors; electronic circuits; microcircuits; integrated circuits; smart integrated circuits; integrated circuits chips; printed electronic circuits for integrated circuit apparatus and cards bearing integrated circuits; electrical or electronic circuits, namely protection circuits; electric or electronic components, namely semiconductors related to contactless payment solution for mobile electronic devices; electric or electronic components, namely chips [integrated circuits] related to contactless payment solution for mobile electronic devices; electric or electronic components, namely semiconductors related to contactless financial transactions for mobile electronic devices; electric or electronic components, namely chips [integrated circuits] related to contactless financial transactions for mobile electronic devices; electric or electronic components, namely semiconductors related to mobile electronic devices ticketing; electric or electronic components, namely chips [integrated circuits] related to mobile electronic devices ticketing; near-field communication technology chips [integrated circuits]; near-field communication technology chips [integrated circuits] used in the field of contactless payment solution for mobile electronic devices; near-field communication technology chips [integrated circuits] used in the field of contactless financial transactions for mobile electronic devices; near-field communication technology chips [integrated circuits] used in the field of mobile ticketing; cryptography software; secure integrated circuits; software solution in the field of contactless financial transactions for mobile electronic devices; software solution in the field of contactless payment solution for mobile electronic devices; software solution in the field of mobile ticketing
42 Engineering services in the field of contactless payment solution for mobile electronic devices; engineering services in the field of financial transactions formobile electronic devices; design of chips [integrated circuits] for others; design of chips [integrated circuits] related to contactless payment solution for mobile electronic devices for others; design of near-field communication technology chips [integrated circuits]; design of software solutions in the field of contactless payment solution for mobile electronic devices; design of software solutions in the field of contactless financial transactions for mobile electronic devices; data encryption services

ID: 11018898931