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The German trademark SolderFill was filed as Word mark on 12/11/2008 at the German Patent and Trademark Office.
It was registered as a trademark on 04/08/2009.
The current status of the mark is "Trademark registered".
| Trademark form | Word mark |
| File reference | 3020080780770 |
| Register number | 302008078077 |
| International trademark | No. IR1009250, July 5, 2024 |
| Application date | December 11, 2008 |
| Publication date | May 8, 2009 |
| Entry date | April 8, 2009 |
| Start of opposition period | May 8, 2009 |
| End of the opposition period | August 10, 2009 |
| Expiration date | December 31, 2028 |
Trademark owner
10553 Berlin
DE
goods and services
1
chemische Erzeugnisse für die Oberflächenbehandlung von Metallen, Halbleitern und Kunststoffen, insbesondere zur Verwendung in der Galvanotechnik; galvanische Bäder; Galvanisiermittel; chemische Erzeugnisse zur elektrolytischen Abscheidung von Zinn und Zinnlegierungen (soweit in Klasse 1 enthalten)
The designations have been translated automatically. Show translation
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| February 2, 2022 | 202200030771 | 8a | Transfer / Change of address, Abgeschlossen |
| November 7, 2018 | 201700422238 | 4 | Extension, Verlaengert |
| September 8, 2009 | 200900143413 | 2a | Opposition period, Marke ohne Widerspruch eingetragen |
| April 8, 2009 | 200900051816 | 1aaa | Registration, Marke eingetragen |
ID: 103020080780770