eG Fill

WIPO WIPO 2007

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The International trademark eG Fill was filed as Word mark on 12/28/2007 at the World Intellectual Property Organization.

Trademark Details Last update: July 17, 2018

Trademark form Word mark
File reference 952886
Register number 073513337
Countries em Japan South Korea Norway Singapore United States of America (USA) Switzerland China North Korea Russia
Base trademark FR No. 07 3 513 337, December 14, 2007
Application date December 28, 2007
Expiration date December 28, 2017

Trademark owner

15 rue du Buisson aux Fraises,
Zone Industrielle de la Bonde
FR

Trademark representatives

41 avenue de Friedland F-75008 Paris FR

goods and services

01 Chemical products containing copper for functionalizing surfaces for use in the semiconductor, integrated circuit, microelectronics, microsystems, printed circuit and electronics industry
07 Industrial machinery for functionalizing surfaces for use in the semiconductor, integrated circuit, microelectronics, microsystems, printed circuit and electronics industry

Trademark history

Date Document number Area Entry
July 7, 2018 2018/27 Gaz Deletion
May 31, 2016 2017/13 Gaz US RAW: Total Invalidation
July 14, 2009 2009/32 Gaz KR Decision on opposition
June 5, 2009 2013/13 Gaz US Decision on opposition
May 6, 2009 2009/23 Gaz SG RAW: Protection Granted
February 10, 2009 2009/11 Gaz NO RAW: Protection Granted
January 19, 2009 2009/4 Gaz EM RAW: Protection Granted
November 20, 2008 2008/50 Gaz KR Rejection
October 23, 2008 2008/43 Gaz JP RAW: Protection Granted
April 18, 2008 2008/17 Gaz US Rejection
December 28, 2007 2008/8 Gaz FR Registration

ID: 14952886